● 最高检测0.2μm的表面缺陷
● 多重放大，优化灵敏度
● 可用分区域的检测算法，以优化灵敏度
● 可导入CAD设计图，基于图纸检测
● 能够在一个检测周期内使用不同的聚焦、放大倍率、光源、灵敏度和检测引擎运行连续扫描
Camtek专为速度和精度而设计的Eagleᵀ-i是市场上最快、最准确的2D检测工具之一。
该系统提供领先的2D检查功能，其动力来自：
• Genesis检测引擎
• 新型号摄像头
• 新型号的高端光纤通道
• 特殊LED照明
• 可导入CAD设计图，基于图纸检测
• 尖端处理能力
Eagleᵀ-i为封装应用程序提供高级解决方案：
• 低至2um RDL检查
• 面板传输及检测
• 翘曲晶圆传输及检测
| Inspection Capabilities 检测能⼒ | Various surface defects inspection of 1 pixel size for
Bright Field and 0.5 pixel size for Dark Field 各种表⾯缺陷，明场可达1个像素⼤⼩缺陷，暗场可达0.5个像素⼤⼩缺陷 |
| Resolution 解析度 | Multiple magnifications for optimized sensitivity 多重倍率并优化敏感度 |
| Zone Editing 区域编辑 | CAD based detection 基于CAD图档的检测 |
| CAD | Enables running successive scans in one cycle with different focus, magnification, illumination, sensitivity and detection enginea |
| Multi Recipe 多重程式并⽤ | Enables running successive scans in one cycle with
different focus, magnification, illumination, sensitivity
and detection engines 允许在⼀个周期内运⾏连续扫描，使⽤不同的对焦位置，倍率， 照明，灵敏度和检测引擎 |
| Defect Classification /
Filtering 缺陷⾃动分类/过滤 | Feature based classification 基于特征的分类 |
| Tool Matching 机台⾃动匹配 | Simple recipe transfer from system to system 简单的程式传送⽅式，从⼀个机台转移到另⼀个机台 System to System results matching 机台互相之间的检测结果匹配 |
| Bumptypes 凸块类型 | Copperpillar,solder,goldbumps,microbumps 铜柱，电镀，⾦凸块，微凸块等 |
| Capabilities 能⼒ | Measurementofbumpheight,co-planarity,PR/PI
thicknessandviaopeningdepthandsurface-tosurfacemetrology 凸块⾼度量测、共⾯性、PR/PI厚度、通孔深度，以及⼀个⾯ 对另外⼀个⾯的量测 |
| CTS‒CamtektriangulationSensor:Highspeed3Dscan CTS-Camtek三⻆测量传感器：⾼速3D扫描 | |
| HeightAccuracy① ⾼度精度① | 0.1μm |
| HeightRepeatability① ⾼度重复精度① | 1%ofbumpheightand>0.2μmat3σ |
| MeasurementRange 量测范围 | 2‒250μm |
| CCS-CamtekConfocalSensor:3Dhighresolutionprofileareamapping CCS‒Camtek共焦传感器：三维⾼分辨率剖⾯区域制图 | |
| HeightRepeatability① ⾼度重复精度① | 0.1μmat3σ |
| LayerthicknessRange 膜厚量测范围 | 5-200μm |
| Heightmetrologyrange ⾼度量测范围 | 1μm-300μm |
| CLIP‒CamtekLightinterferometerprofiler: CLIP‒Camtek光⼲涉仪分析器 | |
| Resolution 解析度 | 0.05μm |
| HeightRepeatability① ⾼度重复精度① | 0.2μmat3σ |
| MeasurementRange 量测范围 | 0.2-100μm |
| Object types 对象类型 | Bump, RDL, Pad, UBM, Via |
| Capabilities 能⼒ | Measurement of diameter, width, length, placement
deviations, overlay, die shift 可测量直径，宽度，⻓度，放置偏差，叠加，晶粒移位等 |
| Accuracy 精度 | 0.1μm |
| Repeatability 重复精度 | 0.2μm at 3σ |
| Setup Online and Offline 可在线和离线进⾏程式设定 | User-defined detection parameters per defect type
and zone. ⽤⼾可根据区域和缺陷类型定义检测参数 Interactive automated routines for easy zone definition 交互式⾃动化例⾏程序易于各区域的定义 |
| Job Portability & Tool Matching 程式易于移植和机台⾃动匹配 | Allows transfer of jobs between compatible models 允许同型号机台间程式的互相传送 running on same SW version for system to system results matching 基于同软件版本，机台与机台扫描结果的匹配 |
| Review Options 复判选项 | Color 彩⾊影像 Black & White ⿊⽩影像 IR 红外影像 |
| Smart Grab 智能抓取缺陷照⽚ | Customized preset for defect type, count and location,
minimizing grabbing and verification time, optimizing
image quality to defect type 定制预设缺陷类型、数量和位置，最⼩化抓取和验证时间，根 据缺陷类型优化图像质量 |
| Offline Station 离线⼯作站 | PC-based station for viewing and reclassification of
defect images captured during scanning (monochrome)
or post-scanning (color and/or monochrome) 基于PC⼯作站，⽤于查看和重新分类扫描期间(⿊⽩影像)或扫 描后(彩⾊和/或⿊⽩影像)抓取的缺陷图像 |
| Histograms 直⽅图 | Distribution charts of all defect and metrology data 所有缺陷及量测数据分布图 |
| Reports 报告 | SPC analysis at lot, wafer and die level, KLARF 对批次，晶圆和晶粒级进⾏SPC分析 |
| Wafer Maps 晶圆图档 | Generate, import, edit and export wafer maps in over
50 standard and custom formats ⽣成，导⼊，编辑和导出超过50种标准和⾃定义格式的晶圆图 |
| Material Handling Dual Arm
Auto Loader 双⼿臂⾃动取放⽚机构 | Dual purpose bare & framed on the same load port 同⼀装载平台上同时⽀持晶圆盒和铁圈 盒 Supports Bare, Taiko, Framed, Stretched and Reconstructed wafers ⽀持Bare, Taiko, Framed, Stretched and Reconstructed 晶圆 4”-12” wafer size 晶圆尺⼨4”-12” |
| Particle Removal System 微尘去除系统 | Removes loose particles, eliminating nuisance calls 去除表⾯微尘，减少误报 |
| OCR ⾃动⽂字识别系统 | Automatic top or bottom wafer ID reading ⾃动正⾯和反⾯的晶圆刻号读取 |
| Barcode Reader 条码读取系统 | Reads data matrix or barcode formats 可识别⼆维码和条形码 |
| Factory Automation ⼯程⾃动化 | SECS/GEM or customized host communication;
OHT/AGV ready SECS/GEM或定制化的主机通信; ⽀持天⻋ /⾃主移动⼩⻋ |
| Cleanliness 洁净度 | Semi class 2 according to ISO-150-14644-1 基于ISO-150-14644-1的Semi class 2 |
①‒AccuracyandrepeatabilityonVLSIsteptarget
①‒基于VLSI标准⽚的精度和重复精度量测
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