ACA-AWB Series-双赢电子科技国际有限公司

AWB Series

• 2D/3D Inspection

• Dual Shuttle

• Treatment

• Offline Review System

• Checking Criteria Group: Wire Bonding, Die Surface, Clip Position, Frame Surface and etc.

AWB Series WirebondAOI 2D / 3D 焊线光学检测设备

设备尺寸: 2060mm(L) x1090mm (W) x1700mm (H)

Strip/Frame兼容: 100mm to 300mm (L) x 20mm to 100mm (W) x 0.1mm to 1.5mm (T)

UPH: Speed range varies depending on Inspection Specification

优势特点

高端光学检测

▪ 2D 或 3D 高速检测

▪ 底部检测 Bottom Inspection

▪ 侧面检测 Side View Inspection

▪ 圆角高度和BLT检查Fillet Height and BLT Inspection

▪ 光检模块固定式 Fixed Mounted Vision Module

▪ 易于升级光检模块 Easy Upgradeable Vision Module

高端光学检测软件

▪ 人性化GUI

▪ 离线程序编程Offline Recipe Creation

▪ 参数和测量范围的精确计算Precise Measurement with Parameters & Criteria Range

▪ 精简而高效计算法 Simple & Powerful Algorithm

▪ 自有IP, 灵活运用Flexible

处理模块Handling Modules

▪ 全自动PC机控制 Fully Automatic PC based Control

▪ 双Shuttle有自动Conversion功能，可实现灵活性和更高的UPH

▪ Series or Parallel 检测选项

缺陷产品处理Rejects Treatment Modules

▪ 多种处理选项Various Treatment Options

▪ 处理后检测功能Post Treatment Inspection

▪ SECS/GEM and E-Mapping

检测规格

AOI检测能力

Die Bond 检测

• Die Missing / No Die

• Die Chip / Crack

• Double Bonded

• Die Tilt / Die Rotation

• Die Scratch / Pad Scratch

• Contamination / Foreign Particles

• Bridging, Coverage, Overflow (Epoxy / Solder)

• Bond Line Thickness

• Fillet Height

• Side Crack

Wire Bond 检测 (Au / Cu /Al)

• Wire Loop Height Measurement

• Broken Wire

• Sagging Wire

• Shorted Wire

• Shifted Wire / Sway Wire

• Lifted Bond

• Long Tail

• Bond Width

• Bond Offset

• Ball Thickness (conditions applied)

*Cu Clip Inspection is also available

检测能力

Multi-Layer Stacked Die Inspection Sample

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其它规格

相机参数

Camera	5 Mega Pixel to 31 Mega Pixel Colour or Mono
Field Of View	Product Dependent
MinimumDetectable Defect	3 pixels
Accuracy	+/-1pixel

缺陷处理模块

Treatment
Options
(Post Inspection)

SECS/GEM,e-Mapping E142 Format
Wire Cut
Wire Pull
Laser Mark/Wire Cut
Lead Punch
Post Treatment Inspection

Handling Capabilities

Lead Frame	Width:20mm to 100 mm. Length:100mm to 300mm Thickness: 0.1mm to 1.5mm
Magazine	Width:25mm to 130mm Length:100mm to 305mm Height: 50mm to 200mm
Output Magazine	Dual Output Magazine (Good & NG)
UPH	Product dependant Frame Matrix 4 x 1:3,000 Frame Matrix 8x 2:6,000 Frame Matrix 32 x 8:28,000 Frame Matrix 102 x 28:100,000 * UPH may vary based on inspection criteria
Customizable	In-Line Solution

Facilities Specifications

Dimensions	2060mm(L)x1090mm(W)x1700mm(H)
Gross Weight	1,000kg
Power Rating	220-240 VAC,50/60Hz,10A
CDA Supply	Min 5-bar

Software Features

User Interface	Easy Device Program Setup Full Algorithm and measurementtechniques provides for inspection criteria
Vision Assist	Review Mode with Defect Map Catch Mode
Others	Lot Defect Summary report Editable defect category description Alarm/Error log and user change log Preventive maintenance notification

Available Add-on Capabilities

Offline Review PC	Review inspection result after production lot Result upload to server
Centralized System	Remote monitor and control machines Capable up to 10 AWB series system
2D Matrix Code	Read 2D Matrix Code on lead frame Mapping upload to server
SECS/GEM	SEMI E37.1-95 High-Speed SECS Message, Single-Session Mode (HSMS-SS)