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AP-1000

High-Performance, High-Volume Plasma Treatment

The AP-1000™ plasma system is designed to meet the rigorous demands of 24-hour operation in high performance manufacturing environments. The system delivers uniform plasma treatment with unmatched reliability, safety and ease of operation.

产品详情
The AP-1000 system provides:

● A compact enclosure that contains the pump, chamber, control electronics, and 13.56 MHz RF generator with impedance matching for unparalleled process repeatability

● Superior durability through a plasma chamber constructed of 11-gauge stainless steel with aluminum fxtures

● An intuitive touch-screen control panel for real-time process monitoring

● Multiple removable and adjustable shelves to accommodate a range of part carriers, including magazines (up to 12), trays, wafer and Auer® boats

● A proprietary software control system that generates process and production data for statistical process control

● Front access to all interior components and the pump is positioned on rollers for easy removal

● Optional high-throughput shelves (AP-1000 HTP) for increased treatment uniformity and decreased process time. Supports a range of process gases including argon, hydrogen and helium, is equipped with four mass fow controllers, and features vertically positioned slotted magazines that hold a minimum of 20 lead frames.


Key Applications

● Plasma cleaning

● Surface activation

● Adhesion improvement

主要参数
Enclosure DimensionsW x D x H – Footprint680W x 1127D x 1890H (26.77W x 62.3D x 74.4H in.)
Net Weight485 kg (1069 lbs.)
Equipment ClearanceRight, Left – 153 mm (6 in.), Front – 680 mm (27 in.)Back – 483 mm (19 in.) min.
ChamberMaximum Volume127 liters (7774 in³)
Variable Electrode ConfgurationsPower-Ground, Ground-Power, Power-Power
Number of Electrode Positions14
Electrode Pitch25.4 mm (1 in.) for 600 W
50.8 mm (2 in.) for 1000 W
ElectrodesPowered Working Area349W x 425D mm (13.74W x 16.73D in.)
Ground/Perforated Working Area384W x 425D mm (15.12W x 16.73D in.)
Floating Working Area349W x 425D mm (13.74W x 16.73D in.)
RF PowerStandard Wattage600 W
Optional Wattage1000 W
Frequency13.56 MHz
Gas ControlAvailable Flow Volumes10, 25, 50, 100, 250, 500, 1000, 2000 or 5000 sccm
Maximum Number of MFCs4
Control System and InterfaceSoftware ControlPLC Control with Touch Screen Interface
Remote InterfacePlasmaLINK, ProcessLINK, SECS/GEM
Vacuum PumpStandard Wet Pump53 cfm with Oxygen Oil Mist Eliminator
Optional Wet Pump53 cfm with Corrosive Oil Mist Eliminator
Optional Purged Dry Pump63 cfm
N2 Purged Pump Flow14 slm
Cooling Water Purged Pump Flow5 slm
FacilitiesPower Supply220 V, 25 A, 50/60 Hz, 3-Phase, 8 AWG, 4-Wire
380 V, 25 A, 50/60 Hz, 3-Phase, 8 AWG, 5-Wire
Process Gas Fitting Size & Type6.35 mm (0.25 in.) OD Swagelok Tube
Process Gas PurityLab or Electronic Grade
Process Gas Pressure0.69 bar (10 psig) min. to 1.03 bar (15 psig) max., regulated
Purge Gas Fitting Size & Type6.35 mm (0.25 in.) OD Swagelok Tube
Purge Gas PurityLab or Electronic Grade N2/CDA
Purge Gas Pressure2 bar (30 psig) min. to 6.9 bar (100 psig) max., regulated
Pneumatic Valves Fitting Size & Type6.35 mm (0.25 in.) OD Swagelok Tube
Pneumatic Gas PurityCDA, Oil Free, Dewpoint ≤7°C (45°F), Particulate Size<5 µm
Pneumatic Gas Pressure3.45 bar (50 psig) min. to 6.89 bar (100 psig) max., regulated
Exhaust38 mm (1.5 in.) OD Pipe Flange
ComplianceSEMIS2/S8 (EH&S/Ergonomics)
InternationalCE Marked
Ancillary EquipmentGas GeneratorsNitrogen, Hydrogen (Requires Additional Non-Optional Hardware)
FacilitiesChiller, Scrubber