

High-Performance, High-Volume Plasma Treatment
The AP-1000™ plasma system is designed to meet the rigorous demands of 24-hour operation in high performance manufacturing environments. The system delivers uniform plasma treatment with unmatched reliability, safety and ease of operation.
● A compact enclosure that contains the pump, chamber, control electronics, and 13.56 MHz RF generator with impedance matching for unparalleled process repeatability
● Superior durability through a plasma chamber constructed of 11-gauge stainless steel with aluminum fxtures
● An intuitive touch-screen control panel for real-time process monitoring
● Multiple removable and adjustable shelves to accommodate a range of part carriers, including magazines (up to 12), trays, wafer and Auer® boats
● A proprietary software control system that generates process and production data for statistical process control
● Front access to all interior components and the pump is positioned on rollers for easy removal
● Optional high-throughput shelves (AP-1000 HTP) for increased treatment uniformity and decreased process time. Supports a range of process gases including argon, hydrogen and helium, is equipped with four mass fow controllers, and features vertically positioned slotted magazines that hold a minimum of 20 lead frames.
● Plasma cleaning
● Surface activation
● Adhesion improvement
| Enclosure Dimensions | W x D x H – Footprint | 680W x 1127D x 1890H (26.77W x 62.3D x 74.4H in.) |
| Net Weight | 485 kg (1069 lbs.) | |
| Equipment Clearance | Right, Left – 153 mm (6 in.), Front – 680 mm (27 in.)Back – 483 mm (19 in.) min. | |
| Chamber | Maximum Volume | 127 liters (7774 in³) |
| Variable Electrode Confgurations | Power-Ground, Ground-Power, Power-Power | |
| Number of Electrode Positions | 14 | |
| Electrode Pitch | 25.4 mm (1 in.) for 600 W 50.8 mm (2 in.) for 1000 W | |
| Electrodes | Powered Working Area | 349W x 425D mm (13.74W x 16.73D in.) |
| Ground/Perforated Working Area | 384W x 425D mm (15.12W x 16.73D in.) | |
| Floating Working Area | 349W x 425D mm (13.74W x 16.73D in.) | |
| RF Power | Standard Wattage | 600 W |
| Optional Wattage | 1000 W | |
| Frequency | 13.56 MHz | |
| Gas Control | Available Flow Volumes | 10, 25, 50, 100, 250, 500, 1000, 2000 or 5000 sccm |
| Maximum Number of MFCs | 4 | |
| Control System and Interface | Software Control | PLC Control with Touch Screen Interface |
| Remote Interface | PlasmaLINK, ProcessLINK, SECS/GEM | |
| Vacuum Pump | Standard Wet Pump | 53 cfm with Oxygen Oil Mist Eliminator |
| Optional Wet Pump | 53 cfm with Corrosive Oil Mist Eliminator | |
| Optional Purged Dry Pump | 63 cfm | |
| N2 Purged Pump Flow | 14 slm | |
| Cooling Water Purged Pump Flow | 5 slm | |
| Facilities | Power Supply | 220 V, 25 A, 50/60 Hz, 3-Phase, 8 AWG, 4-Wire 380 V, 25 A, 50/60 Hz, 3-Phase, 8 AWG, 5-Wire |
| Process Gas Fitting Size & Type | 6.35 mm (0.25 in.) OD Swagelok Tube | |
| Process Gas Purity | Lab or Electronic Grade | |
| Process Gas Pressure | 0.69 bar (10 psig) min. to 1.03 bar (15 psig) max., regulated | |
| Purge Gas Fitting Size & Type | 6.35 mm (0.25 in.) OD Swagelok Tube | |
| Purge Gas Purity | Lab or Electronic Grade N2/CDA | |
| Purge Gas Pressure | 2 bar (30 psig) min. to 6.9 bar (100 psig) max., regulated | |
| Pneumatic Valves Fitting Size & Type | 6.35 mm (0.25 in.) OD Swagelok Tube | |
| Pneumatic Gas Purity | CDA, Oil Free, Dewpoint ≤7°C (45°F), Particulate Size<5 µm | |
| Pneumatic Gas Pressure | 3.45 bar (50 psig) min. to 6.89 bar (100 psig) max., regulated | |
| Exhaust | 38 mm (1.5 in.) OD Pipe Flange | |
| Compliance | SEMI | S2/S8 (EH&S/Ergonomics) |
| International | CE Marked | |
| Ancillary Equipment | Gas Generators | Nitrogen, Hydrogen (Requires Additional Non-Optional Hardware) |
| Facilities | Chiller, Scrubber |