
Insidix is a renowned French leader in providing comprehensive solutions for flatness characteristic measurement and non-destructive testing, offering advanced substrate and packaging measurement solutions for the global microelectronics industry, semiconductor industry, and PCB (circuit board production) industry.
INSIDIXTDM uses Projection Moir é and perfectly simulates the Reflow state to achieve flatness, coplanarity, and thermal deformation measurements, obtaining sample Warpage, Deformation, CTE measurements

● Double sided heating on both sides;
● PID independent regulation of upper and lower temperature, with small temperature difference;
● Non continuous surface testing;
● BGA eliminates ball testing;
● Warpage and CTE can be tested simultaneously;
● High resolution camera with 12 million pixels;
● Can test different devices simultaneously.