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Insidix is a renowned French leader in providing comprehensive solutions for flatness characteristic measurement and non-destructive testing, offering advanced substrate and packaging measurement solutions for the global microelectronics industry, semiconductor industry, and PCB (circuit board production) industry.

INSIDIXTDM uses Projection Moir é and perfectly simulates the Reflow state to achieve flatness, coplanarity, and thermal deformation measurements, obtaining sample Warpage, Deformation, CTE measurements

TDMTechnical Advantage:

 Double sided heating on both sides;
 PID independent regulation of upper and lower temperature, with small temperature difference;
 Non continuous surface testing;
 BGA eliminates ball testing;
 Warpage and CTE can be tested simultaneously;
 High resolution camera with 12 million pixels;
 Can test different devices simultaneously.