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IM5000

ArBlade 5000 is a high-performance model of Hitachi ion grinder.

It achieves ultra high speed section grinding.

The high-efficiency cross-sectional processing function makes sample processing easier during electron microscopy cross-sectional observation.


Main features of IM5000
The cross-sectional grinding rate can reach up to 1 mm/h * 1!

The newly developed PLUSII ion gun emits a high current density ion beam, significantly increasing the grinding rate by 2.

The newly developed PLUSII ion gun emits a high current density ion beam, significantly increasing the grinding rate by 2.

The grinding rate is twice that of our company's product (IM4000PLUS: 2014 production)

Comparison of cross-sectional grinding results

(Sample: Automatic pencil lead, grinding time: 1.5 hours)

Our company's product IM4000PLUS

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ArBlade 5000


The maximum cross-sectional grinding width can reach 8 mm!

Using a wide cross-sectional grinding sample holder, the processing width can reach 8 mm, which is very suitable for grinding electronic components and other materials.

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Composite grinder

The new composite ion grinder (cross-sectional grinding, planar grinding) has received widespread praise.

Samples can be pre processed according to requirements.

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Section grinding

Cross section production of soft materials or composite materials that are difficult to handle by cutting or mechanical grinding

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Flat grinding

Refinement or surface cleaning of samples after mechanical grinding

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Main parameters
Universal
Use gasAr
Accelerating voltage0~8 kV
Section grinding
Fastest grinding rate (material Si)Above 1 mm/hr * 1, including 1 mm/hr * 1
Maximum grinding width8 mm*2
Maximum sample size20(W) × 12(D) × 7(H) mm
Sample movement rangeX ±7 mm、Y 0~+3 mm
Intermittent processing function of ion beam

Standard Configuration

Swing angle±15°、±30°、±40°
Flat grinding
Maximum processing rangeφ32 mm
Maximum sample sizeφ50 × 25(H) mm
Sample movement rangeX 0~+5 mm
Intermittent processing function of ion beamStandard Configuration
Rotation speed1 r/m、25 r/m
Tilt angle0~90°

*1 Si protruding shield edge of 100 µ m, maximum processing depth in 1 hour

*2 When using a wide cross-section grinding sample holder


Optional
ProjectContent
High wear-resistant shielding plateThe wear-resistant shielding plate is about twice that of the standard shielding plate (excluding cobalt)
Processing monitoring microscopeMagnification ratio of 15 ×~100 × for binocular and trinocular models (CCD can be added)