By achieving high resolution, world-class signal quality, non-destructive and high-precision analysis of wiring faults in advanced semiconductor packaging (failure analysis)

Due to the miniaturization of electronic devices and the development of high-density integrated structure technology, there is an increasing demand for systems that correspond to various analysis conditions and optimize analysis environments in semiconductor packaging fault analysis.

The TS9001TDR system utilizes our company's independently developed short pulse signal processing technology for high-resolution TDR measurement (time-domain reflection measurement), high-speed and high-precision non-destructive analysis, to detect and locate wiring faults within advanced semiconductor packages.

In addition, our TS9001 system can be connected to high-frequency probe systems owned/selected by customers, providing flexible solutions for testing body shapes (wafers, ICs) and fault analysis environments.

High speed&high-resolution measurement

● Can perform failure analysis for advanced packaging such as BGA, wafer level, 2.5D/3.5D, etc. with corresponding area array packaging

● The resolution of fault location can reach below 5 μ m

● The measurement takes 30 seconds (an average of 1024 times, which is 1/10 faster than our existing products)

Temperature regulation function

By connecting with a high-frequency probe system with heating system function, the sample can be subjected to fault analysis (failure analysis) evaluation under low/high temperature conditions

Multiple analysis software can be provided

Provide CAD Data Link (fault location indication software), which can display the fault area on CAD data. (optional)

Apply signals to the tested object and measure the time response waveform of the reflected signal from the input terminal to analyze the positions of open and short circuits.

Compare the waveforms of good and defective products, and use the peak positions and measurement points that only appear in defective products to determine the location of the faulty area.

Case study on TDR measurement analysis of transmission lines (length 4/6/20mm) that have already formed OPEN/SHORT structure

● In fault mode, a positive reflected pulse wave can be observed when OPEN, and a negative reflected pulse wave can be observed when SHORT

● The probe signal used in this system is related to Impulse, making it easy to determine the location of the fault point based on the peak position of the pulse

The TS9001TDR system serves as the standard equipment for the TDR Analyzer. In addition to displaying the waveforms of Reference and Sample with differences, it is also possible to detect changes in the waveform and estimate the distance from the pad to the fault point

When inferring the fault area, the CAD Data Link (optional software) can be used to map and display on the CAD wiring data as an auxiliary function for specific fault points