Cross sectional samples prepared by the SMC2000 system for subsequent detection or other required analysis using scanning electron microscopy
SMC2000 uses a patented process of scratch fracture micro cutting to prepare cross-sectional samples, where the fracture propagates along one or two orthogonal cutting vectors of the chip.
TEM >> ISMC2000I2 >> SEMI >> FIBI >> lon Milling
Intelligent software SmartVision
FW01 Rapid Sample Preparation Platform for Initial Sample Preparation
Precise control of material mechanics and fracture mechanics
*By forming micro scratches on the surface of the sample to be cracked, precise and controllable mechanical stress is applied to the wafer using a precision cracking module. The brittle fracture characteristics of the wafer material are utilized to induce cracks in specific crystal orientations and predetermined weak areas.
*Advanced algorithms and high-precision equipment ensure uniform stress, enabling stable crack propagation along predetermined paths and achieving precise wafer segmentation.
Material Compatibility
Single crystal materials such as silicon (Si), gallium arsenide (GaAs), indium phosphide (InP), etc
● Intelligent CNC natural fracture control technology
● High precision multi axis linear control technology
● Efficient sample preparation
● Advanced stress control algorithm
● Excellent and stable targeted positioning
● Full process digital monitoring
● Compatible with single crystal materials such as silicon chips, gallium arsenide (GaAs), indium phosphide (InP), etc., supporting sample thicknesses up to 2000 microns
● Independently developed professional software, integrating macroscopic and microscopic fields of view, and a numerical automatic focusing system
● Independent research and development, high performance, low cost, perfect replacement
| Serial number | Project | Mobile capability of the carrier platform | ||
| X-axis | Y-axis | Z-axis | ||
| 1 | Itinerary | 50mm | 30mm | 10mm |
| 2 | Highest positioning accuracy | 2um | 2um | 1um |
| 3 | Sample unevenness adaptability | 100um | 100um | 100um |
| 4 | X Position Lock Value | 2um | NA | NA |
| 5 | Y Position Lock Value | 2um | NA | NA |
| 6 | Z Position Lock Value | 1um | NA | NA |
| 7 | Macro perspective | 8*8mm | NA | NA |
| 8 | Microscopic perspective | 0.5*0.5mm | NA | NA |
| 9 | Typical range of magnification | ≥1000X | NA | NA |
| 10 | Typical optical lens resolution | 1.5um | NA | NA |
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Phone：86-18912625555 Mr Chen
Email：alan.chen@winwintek.com/ wuj@winwintek.com
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