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ASYMTEK Spectrum II S2-900

Higher consistency can bring higher output and maximum profitability to your business. Whether it's bottom filling glue dispensing in PCBA applications, precise coating in the mobile or consumer electronics technology industry, or solder paste sealing lines, Spectrum ®  The II fluid dispensing machine is the preferred system for large-scale production worldwide.

Choose the standard system package to obtain the fluid spray adhesive system with the shortest delivery time.

Features and Advantages

Upgradeable design can meet users' current and future process requirements, achieving maximum return on investment

High precision X-Y-Z mobile system

High precision full system dispensing, including glue points and glue lines

Patent closed-loop process control ensures consistency in dispensing volume during continuous production

The independent X-Y-Z axis dual valve synchronous dispensing option can effectively increase production

Integrated visual system, providing coaxial or off-axis illumination methods

Up to 6 heating platforms can be selected

Programmable dual axis tilt option


Product Details

The upgradable Spectrum II series dispensing system is an ideal choice for advanced dispensing processes to achieve mass production, including bottom filling, cavity filling, chip bonding, and encapsulation.

Upgradeability.With its flexible and upgradable features, SpectrumII can be configured to use single or double tracks, with up to six heating platforms available in the double track configuration. When the process needs to be changed, the platform can be easily upgraded on site.

Without selecting a pre heating or post heating platform, the width of SpectrumII is only 600 millimeters, making full use of valuable factory space.

Advanced process control. Spectrum II reduces process variables, increases production capacity, and reduces costs. The temperature, adhesive amount, and air pressure controlled by software provide closed-loop control, reducing manual adjustment by operators. The Automatic Process Calibration Spray Technology (CPJM) can ensure the repeatability of adhesive volume over a long production process. The process control heater (CpH) adopts programmable thermal management to achieve better thermal efficiency.

The SpectrumII standard digital imaging system features adjustable RGB tri color LEDs with higher brightness, providing high-quality image contrast and observation effects for more accurate and consistent pattern recognition. For most challenging visual applications, the Monocle Vision Pack (MVP) further enhances contrast effects, field of view, and resolution.

Nozzle and valve technology.You can customize SpectrumII to meet specific process requirements through industry-leading ASYMTEC nozzle and valve technology. We offer a range of options, including our popular nozzles and time pressure valves, as well as the latest screw pumps.

Professional value and support.With nearly 40 years of accurate dispensing experience and an excellent reputation for optimal closed-loop process control, Nordson is a reliable partner for dispensing development and production. From initial process development to full-scale production, users will always receive support from our global engineering experience, application development, and technical service network.


Motor systemZ-axis repeatability (1): 15 microns (0.0006 inches), 3 sigma
X-Y repeatability (1): 15 microns (0.0006 inches), 3 sigma
X-Y acceleration: 1g maximum
X-Y speed: 1 meter/second maximum (40 inches/second)
X-Y-Z encoder resolution: 1 micron
Accuracy and repeatability of glue dispensingSingle dispensing valve:
Cp ≥ 1.0: ± 35 microns (0.0016 inches)
Cp ≥ 1.0 (1): ± 40 micrometers (0.0016 inches)
Z-axis clearanceZ-axis repeatability (2): 15 microns (0.0006 inches), 3 sigma
Minimum Z-axis clearance: 50 microns (0.002 inches)
Glue dispensing area (X-Y)339x410 millimeters (13.3x16.1 inches)
transmission system

Minimum width of substrate/carrier (3): 34 millimeters (1.3 inches)

Maximum thickness of substrate/carrier: 12 millimeters (0.5 inches)

Maximum length of substrate/carrier: Single platform: 340 millimeters (13.4 inches), triple platform: 320 millimeters (12.6 inches)

Minimum length of substrate/carrier: 25 millimeters (1.0 inch)

Maximum width of substrate/carrier: Single track: 535 millimeters (21.1 inches) Double track: up to 228 millimeters (9.0 inches) (configuration variable)

Maximum gap above substrate: 30 millimeters (1.2 inches) standard

Factory requirementsSystem land occupation:
Single heating platform: 600mm wide x 1321mm deep (23.6 x 52.0 inches) Dual heating platform: 850x1321mm (33.5x52.0 inches) Triple heating platform: 1100x1321mm (43.3x52.0 inches) Air supply: Dual compressed air supply: one 3CFM@100psi Compressed air supply contact heater, as well as a second one 1CFM@100psi The remaining parts of the compressed air supply system (100psi=689kPa, 6.8atm) power supply (main):
corresponding power supply, 200-240 volts AC, 47-63Hz single-phase, 30A
Note: No heating options need to be installed, the system can also operate at 10A and 220V. Ventilation: Downward or upward ventilation system weight (4): 377-422 kilograms (830-930 pounds)
(1) The Ck value of adhesive dispensing is obtained by testing the sealing line diameter and adhesive point accuracy measurement method according to ASYMTEK company's standard
(2) The measurement of Z-axis spacing repeatability data is based on ASYMTEK's standard white porcelain tiles, and the measurement data may differ when using other substrates
(3) Please contact the factory for smaller sized substrates or carriers.
(4) The weight of the system may vary due to different configurations.

Compatible with standards

Semi S2-0818
Semi S8-0218
EN 60204-1:2018CE)
SMEMA

More optional features and configurations

CpHTMMore optional features and configurations

Dual valve asynchronous dispensing (two dispensing valves operate independently)

External large capacity glue storage tank: 600 milliliters (20 ounces), including external glue inlet and adhesive level sensor

Heating plate, process development (batch processing), low adhesive sensor (magnetic induction or capacitive)

MonocleTMThe Visual Package (MVP) provides greater contrast and field of view with higher resolution images.

SECS/GEM interface

Chain ventilation for volatile organic compound dispensing (such as flux or primer)


Size

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