• 2D/3D Inspection
• Dual Shuttle
• Treatment
• Offline Review System
• Checking Criteria Group: Wire Bonding, Die Surface, Clip Position, Frame Surface and etc.
Size: 2060mm(L) x1090mm (W) x1700mm (H)
Strip/Frame: 100mm to 300mm (L) x 20mm to 100mm (W) x 0.1mm to 1.5mm (T)
UPH: Speed range varies depending on Inspection Specification
▪ 2D or 3D high-speed detection
▪ Bottom Inspection
▪ Side View Inspection
▪ Fillet Height and BLT Inspection
▪ Fixed Mounted Vision Module
▪ Easy Upgradeable Vision Module
▪ GUI
▪ Offline Recipe Creation
▪ Precise Measurement with Parameters & Criteria Range
▪ Simple & Powerful Algorithm
▪ Own IP, flexible
▪ Fully Automatic PC based Control
▪ Dual Shuttle has automatic conversion function, which can achieve flexibility and more 高的UPH
▪ Series or Parallel
▪ Various Treatment Options
▪ Post Treatment Inspection
▪ SECS/GEM and E-Mapping
• Die Missing / No Die
• Die Chip / Crack
• Double Bonded
• Die Tilt / Die Rotation
• Die Scratch / Pad Scratch
• Contamination / Foreign Particles
• Bridging, Coverage, Overflow (Epoxy / Solder)
• Bond Line Thickness
• Fillet Height
• Side Crack
• Wire Loop Height Measurement
• Broken Wire
• Sagging Wire
• Shorted Wire
• Shifted Wire / Sway Wire
• Lifted Bond
• Long Tail
• Bond Width
• Bond Offset
• Ball Thickness (conditions applied)
*Cu Clip Inspection is also available
| Camera | 5 Mega Pixel to 31 Mega Pixel Colour or Mono |
| Field Of View | Product Dependent |
| MinimumDetectable Defect | 3 pixels |
| Accuracy | +/-1pixel |
| Treatment Options (Post Inspection) | SECS/GEM,e-Mapping E142 Format Wire Cut Wire Pull Laser Mark/Wire Cut Lead Punch Post Treatment Inspection |
| Lead Frame | Width:20mm to 100 mm. Length:100mm to 300mm Thickness: 0.1mm to 1.5mm |
| Magazine | Width:25mm to 130mm Length:100mm to 305mm Height: 50mm to 200mm |
| Output Magazine | Dual Output Magazine (Good & NG) |
| UPH | Product dependant Frame Matrix 4 x 1:3,000 Frame Matrix 8x 2:6,000 Frame Matrix 32 x 8:28,000 Frame Matrix 102 x 28:100,000 * UPH may vary based on inspection criteria |
| Customizable | In-Line Solution |
| Dimensions | 2060mm(L)x1090mm(W)x1700mm(H) |
| Gross Weight | 1,000kg |
| Power Rating | 220-240 VAC,50/60Hz,10A |
| CDA Supply | Min 5-bar |
| User Interface | Easy Device Program Setup Full Algorithm and measurementtechniques provides for inspection criteria |
| Vision Assist | Review Mode with Defect Map Catch Mode |
| Others | Lot Defect Summary report Editable defect category description Alarm/Error log and user change log Preventive maintenance notification |
| Offline Review PC | Review inspection result after production lot Result upload to server |
| Centralized System | Remote monitor and control machines Capable up to 10 AWB series system |
| 2D Matrix Code | Read 2D Matrix Code on lead frame Mapping upload to server |
| SECS/GEM | SEMI E37.1-95 High-Speed SECS Message, Single-Session Mode (HSMS-SS) |
【 WeChat 】
Address：No. 501, Building 01, Northwest District, Suzhou Nano City,
No. 99, Jinjihu Avenue, Suzhou Industrial Park
Hotline：86-0512-62749825
Phone：86-18912625555 Mr Chen
Email：alan.chen@winwintek.com/ wuj@winwintek.com
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