Advanced Fully Automated Wafer Testing Technology
The Nordson DAGE 4800 employs cutting-edge wafer testing technology, capable of testing wafers ranging from 200mm to 450mm in diameter.
By combining mature technology with the latest Paragon automation software, it delivers unparalleled accuracy, repeatability, and result stability. The Nordson Dage 4800 stands out as the most advanced and distinctive product in its market category.
Unparalleled accuracy and repeatability ensure that you have confidence in the quality of your test results.
The control (reset) of the cutting height is crucial for achieving consistent test results in cutting applications. Nordson DAGE's unique patented reset system helps set and control the shear height, resulting in a reset accuracy of+/-0.25 micrometers.
A series of powerful camera and optical system optimization loading tools for alignment, automatic programming, and testing analysis.
Quickly and efficiently remove residue from the pusher and gripper.
The advanced optical components of the 4800 welding strength tester, combined with the dual vibration reduction device and adjustable window of the microscope, provide unparalleled image stability.
Unique vector fine-tuning control, providing a small keyboard operation with programmable micro buttons for precise step movements to ensure final position accuracy.
A fully automated testing program can be configured to run a set of tests on selected or random molds using intuitive wafer mapping modules. Assist users from loading to results, including camera alignment, failure mode determination, and graphical data display.
The Nordson DAGE ParagonTM testing software has great configurability and intuitive interface, as well as various advanced features such as automatic GR&R calculations, built-in diagnostics, a range of charts, and a unique database search engine wizard. The airborne imaging system can be used for automatic alignment through benchmark matching.
ParagonTM testing software provides ultimate flexibility for creating wafer diagrams, allowing for quick and accurate setting of testing modes; It is easy to edit virtual images for each testing mode. You can choose from the following methods:
● Use unique onboard intelligent automatic wafer drawing software to scan wafers
● Import wafer drawings in industrial standard format
● Simply click on the wizard with the mouse to write programs for any test point at any position on the wafer
The unique industry-leading multifunctional testing module extends the versatility of the 4800 welding strength tester.
The operator can easily identify which sensor is active through the testing module window, and the "temporary storage location" will protect the sensors inside the testing module.
The existing testing modules used on the 4000 and 4000Plus welding strength testers are also compatible with the 4800 system.
Highlights:
● Ergonomic design, lightweight grip handle for safe and secure movement
● Can be quickly and easily exchanged with single function testing modules
● Patented air bearing technology for shear force testing
● The 'temporary storage location' protects the sensors inside the testing module
● Sensor application window
The 4800 system provides a range of optical solutions:
Image acquisition system
Provide high-resolution images for failure mode analysis. Built into the system, the position near the testing head can maximize production, especially suitable for automated testing.
Image acquisition system
Provide high-resolution images for failure mode analysis. Built into the system, the position near the testing head can maximize production, especially suitable for automated testing.
Integrated image acquisition and alignment camera
Triple-lens camera
With the help of a suitable microscope, the field of view can be adjusted from far to near, which is very suitable for micro positioning. When used in conjunction with a side facing camera, two views (front and side) help achieve precise calibration of the test head. In addition, high-power optical devices can be used to observe ultrafine feature points below 20 microns to assist operators in shear force testing calibration.
Integrated calibration
Side facing cameras are very suitable for testing micro features. It supports auxiliary viewpoint function and can provide accurate and reproducible testing. The side facing camera is connected to the testing module bracket, providing ultra stable, vibration free, and continuously focused images of the testing position.
Aperture imaging system
Aperture meters can provide high magnification images, making them ideal for precise calibration of tools. It can also achieve offline failure mode analysis, test grading, and real-time test recording.
The intelligent edge lifting tray has a unique design, and the edge lifting support feet can ensure that bent wafers and thin wafers will not slip off the tray. Gradual vacuum pressure forms the optimal vacuum on the wafer.
Product features include:
Pre adjust accuracy
Eliminating lateral movement by fully supporting the wafer at the edge. This ensures secure wafer placement for each application.
The built-in crosshair camera is aimed at the target
This alignment ensures that the operator is 100% confident in the position of the load tool relative to the chuck. This calibration greatly improves accuracy.
Integrated calibration
Ensure the accuracy and reliability of the results through built-in validation and testing module calibration.
The multifunctional programmable controller ensures the safe and reliable transmission of wafers. Integrating it seamlessly into Paragon software can provide feedback on vacuum clamping pressure, thereby preventing damage to the wafer.
More importantly, the operator can easily see continuous feedback information on vacuum and air pressure, so measures can be taken to prevent damage to the wafer in the event of a compressed air supply interruption.
The automatic image acquisition system locates the correct position to optimize image quality. The extended depth of field option will also generate autofocus images and invalid 3D maps.
Typical Failure Modes
CHAD wafer processor
Nordson DAGE4800 is integrated with wafer processing systems to ensure operational reliability and repeatability.
The integrated wafer processing system transforms DAGE4800 into a fully automated system that utilizes the next-generation ParagonTM solder strength testing software to ensure reliable and repeatable operations.
The highly intuitive and configurable interface provides fast and easy automated testing program development and execution for various sample configurations.
A step-by-step guide guides users through the setup process to meet various selection needs. Paragon also provides the ability to simultaneously display and record views from multiple cameras.
Nordson DAGE 4800 Integra is a complete solution for automatic wafer bonding strength testing. The entire system is configured by the factory and controlled by a PC.
Almost no need for operator intervention in testing
The system is fully controlled by Paragon TM software and, after programming, can automatically execute all parts of the test without the need for operator intervention.
Comprehensive SECS/GEM integration
The system is directly connected to the network to allow comprehensive SECS/GEM operations. When used in conjunction with FOUP loading systems, testing, analysis, and results can be fully automated.
Cleanroom compatibility
Optional fan filtration device and front door can be equipped with ion removal device for clean room operation.
Automatic wafer corrector
The wafer corrector ensures that warped wafers can be automatically clamped onto the vacuum suction cup before testing.
Fan filter
The 4800 Integra can be installed with fan filters and enclosed doors. This can maintain positive pressure inside the system and expel debris from the testing area.
Interlock options
Light curtains or interlocking doors can be installed to protect operators from harm in the testing area. The system will pause the current test when the light curtain or interlocking door is damaged or opened, and restart after the obstacle is eliminated.
CCD camera monitoring
The optional CCD camera can be installed on the wafer processing machine or inside the 4800 Integra. Allow monitoring and recording of the testing process.
| Size | 1075 x 980 x 855 (ex PC) |
| Weight | 170Kg |
| Power supply | 90 - 264V AC， 47 - 63 Hz， Single phase, universal |
| Gas supply | Minimum 4 bar, plastic pipe with outer diameter of 6mm/inner diameter of 4mm |
| Supply vacuum | Minimum 67kPa, plastic pipe with outer diameter of 6mm/inner diameter of 4mm |
| Interface | USB, Gigabit Ethernet/Gigabit Ethernet port |
| XY Stage | X stroke 550mm Y stroke 410mm High resolution linear encoder |
| Z-axis | Z stroke 75mm |
| Overall system accuracy (please refer to detailed loading box specifications) | Up to+/-0.05% FSD (please refer to loading box specifications) |
| Optical/Photographic Systems | Integrated image acquisition High-power microscope triple-lens camera Alignment camera (large field of view) Side alignment camera Aperture imaging system |
| Test mode | manual operation semi-automatic Fully automatic recognition through reference points and models Aircraft wafer image creation Wafer diagram download |
| Software | ParagonTM SECS/GEM (please consult the factory) |
| Wafer loading | Manual device through crystal box Fully automatic, loading from left or right (factory configuration) EFEM |
| Compatibility | European policy Mechanical Policy (2006/42/EC) Low voltage policy (2006/95/EC) EMC compatibility (2004/108/EC) RoHS compatibility (2002/95/EC) CE Declaration of Conformity ISO 9001:2008 SEMI (S2) |
【 WeChat 】
Address：No. 501, Building 01, Northwest District, Suzhou Nano City,
No. 99, Jinjihu Avenue, Suzhou Industrial Park
Hotline：86-0512-62749825
Phone：86-18912625555 Mr Chen
Email：alan.chen@winwintek.com/ wuj@winwintek.com
Copyright © 2026 Win-Win Electronic Technology International Limited Su ICP NO.2025215884-1 Support：HuiCheng