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TDM Compact3 V2

Full modularity and flexibility

Precise warpage and CTE measurement on a nano micrometer scale across a temperature range of -65°C to 400°C

● Smaller footprint

● Noise level < 50 dB

● Redesigned oven

● New CTE module with improved resolution

● OCT sensor enabling nano-resolution measurement on transparent, semitransparent, and glossy surfaces

● Precise warpage and CTE measurement on a nano micrometer scale across a temperature range of -65°C to 400°C

产品规格
MEASUREMENT TECHNOLOGPHASE SHIFT PROJECTION MOIRÉ
CAMERA RESOLUTION
12 mpixel
DATA ACQUISITION
2 second
MAX SAMPLE SIZE
400 x 700 mm
MIN SAMPLE SIZE
0.5 x 0.5 mm
MAX TEMPERATURE
400°C
MIN TEMPERATURE
-65°C (or room temp if no subroom module)
MAX HEATING RATE
5°C/S on typical 14 x 14 x 1.2 mm package
MIN COOLING RATE
-3°C/S on typical 14 x 14 x 1.2 mm package
HOMOGENEITY (*)
<+/-5°C on 12&rsquo;&rsquo; silicone wafer in range (-65, 250°C)

 
FOV 10
FOV 30
FOV 90
FOV 150
FOV 300
FOV SIZE (mm x mm)
10 x 12
30 x 37
90 x 110
150 x 187
300 x 375
MAX AMPLITUDE (mm)
4
15
15
25
30
Z RESOLUTION (µm)
<1µm
1µm
1,5µm
2µm
2,5µm
ACCURACY
<1µm + 2%
1µm + 2%
1,5µm + 2%
2µm + 2%
2,5µm + 2%
DENSITY (px/mm2)
90 000
10 000
1 100
400
100

STRAIN / CTE MODULE
For all FOVs from -65°C to 400°C
OCT MODULE new
Interferometry nanometer resolution
SUBROOM
For all FOVs from -65°C to 400°C
SCANNING  INCLUDED*
For FOV 10, 30 and 70 on the full 300 x 375 area
MULTISCALE INCLUDED*
For all FOVs

FOOT PRINT L x W x H
1620 mm x 900 mm x 1950 mm
WEIGHT
575 kg
ELEC. FACILITIES
400 V, 3 phases, 75 amps
AIR REQUIREMENTS
Compressed air and exhaust

* Included in standup package

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