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CSX-100LAB

It is a device specifically designed for preparing cross-sectional observation samples, which can utilize the cutting surface polishing effect (PolishCutTM) developed by our company's "ultrasonic cutting technology" to simultaneously perform "cutting" and "polishing".

 Beautiful cut surface

 Accurately cut at the target location

 Can cut samples up to 9mm thick

 Cut invisible target objects using skeleton cutting (OP) method

 No skills required to prepare cross-sectional observation samples

 No need for resin hardening time (shortened delivery time)

 Simple and compact (space saving - can be installed in the laboratory)

Ultrasonic cutting device

It is a device specifically designed for preparing cross-sectional observation samples, which can utilize the cutting surface polishing effect (PolishCutTM) developed by our company's "ultrasonic cutting technology" to simultaneously perform "cutting" and "polishing".

● Beautiful cut surface

● Accurately cut at the target location

● Can cut samples up to 9mm thick

● Cut invisible target objects using skeleton cutting (OP) method

● No skills required to prepare cross-sectional observation samples

● No need for resin hardening time (shortened delivery time)

● Simple and compact (space saving - can be installed in the laboratory)

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Equipment that helps improve the efficiency of product analysis and inspection

Ultrasonic assisted cutting

Principle of Ultrasonic Cutting Assistance

The blade cutting used in traditional semiconductor and electronic component production lines only uses the force generated by the rotation of the grinding wheel for cutting. Ultrasonic assisted cutting is a technology that applies ultrasonic waves to the force caused by the rotation of the grinding wheel and performs cutting while vibrating the grinding wheel in the outer circumferential direction.

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Expected effect

①Hammer effect

Through ultrasonic impact, hard and brittle materials such as SiC can be crushed or crushed to improve cutting ability.

②Cleaning effect

The chips generated by ultrasonic vibration are subjected to the impedance of cutting water, which enhances the removal performance of the blade and prevents clogging.

③Cutting water inflow effect

The amplitude of ultrasonic waves will create gaps, promoting the inflow of cutting water. Can make chip removal smooth and increase lubrication, reduce cutting resistance.

④Sectional Grinding Effect (PolishCut)

By moving the sharpening stone up and down to form a cutting surface, the cutting marks are smoothed and a smooth cutting surface is formed


The advantages of ultrasonic assisted cutting

The advantages of using ultrasonic assisted blade cutting are

(1)High speed cutting and improving cutting quality
High speed cutting, less processing load, can improve quality through small-diameter abrasive machining

(2)Reduce blade wear
Reduce blade wear and extend blade life

(3)Section grinding effect
Only after cutting, the cut surface will be as smooth as polished.