It is a device specifically designed for preparing cross-sectional observation samples, utilizing the cutting surface polishing effect (PolishCutTM) of "tidal wave assisted cutting technology" to simultaneously perform "cutting" and "polishing". The blade cutting used in traditional semiconductor and electronic component production lines only uses the "force generated by blade rotation" for cutting. It is easy to cause cracks or hidden cracks, and ultrasonic assisted cutting is a technology that applies ultrasonic waves to the force caused by the rotation of the blade and vibrates the blade in the outer circumferential direction while cutting, without producing cracks or hidden cracks.
It is a device specifically designed for preparing cross-sectional observation samples, which can utilize the cutting surface polishing effect (PolishCutTM) developed by our company's "ultrasonic cutting technology" to simultaneously perform "cutting" and "polishing".
● Beautiful cut surface
● Accurately cut at the target location
● Can cut samples up to 9mm thick
● Cut invisible target objects using skeleton cutting (OP) method
● No skills required to prepare cross-sectional observation samples
● No need for resin hardening time (shortened delivery time)
● Simple and compact (space saving - can be installed in the laboratory)
It is a device specifically designed for preparing cross-sectional observation samples, which can utilize the cutting surface polishing effect (PolishCutTM) developed by our company's "ultrasonic cutting technology" to simultaneously perform "cutting" and "polishing".
● Beautiful cut surface
● Accurately cut at the target location
● Can cut samples up to 9mm thick
● Cut invisible target objects using skeleton cutting (OP) method
● No skills required to prepare cross-sectional observation samples
● No need for resin hardening time (shortened delivery time)
● Simple and compact (space saving - can be installed in the laboratory)