The system is suitable for high-temperature reverse bias HTRB+/HTRB - and high-temperature gate bias testing HTGB and aging screening of SiC wafers of 8 inches and below; Block the entry of defective dies into the subsequent cutting, packaging, aging testing, and other processes earlier.
Support simultaneous and multi-channel full die loading aging conditions, and the number of channels can be expanded
When the chuck plate automatically heats up to the set value, it automatically cools the fixture without the need for additional cooling assistance, reducing usage costs
The software supports compatibility with wafer production line processes and supports import and export of Map data
Wafer ID reading, fixture QR code recognition, aging data binding with wafer, data traceability
Support simultaneous and multi-channel full die loading aging conditions, and the number of channels can be expanded
The fixture adopts a heating and insulation integrated design, which performs better in temperature uniformity and accuracy
The maximum detection accuracy of leakage current can reach 100pA, meeting the gate leakage detection requirements of SiC
Different aging power supplies are configured in the system, and different aging scenarios are selected according to user needs
| Number of tests | Support simultaneous aging of 5 channels; The independent detection of each board in each zone can reach 768 Die |
| Test temperature | The room temperature of each heating station is around 200 ℃, with an accuracy of ± 2 ℃ and a temperature overshoot of ≤ 3 ℃ |
| HTRB | Voltage range of 0-2000V, resolution of 1V |
| IDSS current detection | 0.1uA～1mA， Resolution 0.1uA, detection accuracy ± (1% rdg.+2LSB) |
| HTGB | Voltage ± 60V, resolution 0.1V |
| IGSS current detection | 10nA～100uA， Resolution 10pA, detection accuracy ± (1% rdg.+2LSB) |
| Vth threshold voltage detection | 0~10.0V， Resolution 0.1V |
| Protect air pressure | 0-4bar inert gas |
The HTRB/HTGB test mode is automatically switched through software settings.
· The Chuck table adopts a marble base with three degrees of freedom: X, Y, and T;
· The alignment system uses a 5-megapixel camera, coaxial light source, and self-developed algorithm;
· The wafer transfer system adopts a modular design, including a robot, an aligner, and a set of material box loading systems.
8-inch and below wafers can be replaced by Chuck tables
Automatically realize the assembly and separation of probe boards and wafers
Barcode recognition supports batch input of product information
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