TESCAN-AMBER-Win-Win Electronic Technology International Limited

AMBER

TESCAN AMBER 2 Gallium Ion Dual Beam Focused Scanning Electron Microscope System (FIB-SEM)

The fully automated gallium (Ga) ion FIB-SEM system enables easy preparation of conventional samples, fine characterization of nanoscale samples, and application of multifunctional prototype design

Main features

●　Through the integrated TESCAN TEM AutoPrep Pro ™ The module achieves fully automated preparation of multiple TEM samples from multiple positions of the sample, significantly improving the efficiency of TEM sample preparation.

●　TESCAN Essence ™ The intuitive operation of the software interface can shorten the time required for data acquisition, automate the alignment of SEM and FIB tubes, and combine with advanced sample stage anti-collision alarm system, allowing non professional users to easily perform FIB-SEM operations.

●　Use an integrated wide ion beam for final polishing to prepare high-quality and minimally damaged TEM samples.

●　Preparation of TEM samples using reverse or flat cutting methods to explore new characterization approaches for challenging materials. The unique nano manipulator position design facilitates the transfer of TEM samples from raw materials to the grid while maintaining the selected feature direction.

●　A FIB-SEM integrates the capabilities of manufacturing, designing, and processing materials, including electron beam lithography, ion beam prototyping, focused electron beam induced deposition (FEBID), or focused ion beam induced deposition (FIBID) applications, demonstrating multifunctional and excellent device design capabilities.

●　Equipped with the world's leading OrageTM FIB tube, its ion beam current of up to 100 nA can greatly improve analysis efficiency and quickly obtain valuable data.

●　Achieve unmanned and multi-point batch TEM sample preparation, allowing operators more time to handle other tasks while significantly improving throughput and work efficiency. This feature supports preparation at different locations and on multiple samples, and can adapt to running at any time, even overnight.

●　Utilize AutoSlicer ™ The intuitive template, which includes various editable attributes such as material type and etching rate, enables the preparation of TEM samples with the best characteristics from multiple materials, meeting the high standard requirements of (S) TEM analysis.

●　AMBER's multimodal detector system, combined with energy dispersive spectroscopy (EDS), electron backscatter diffraction (EBSD), time-of-flight secondary ion mass spectrometry (ToF SIMS), or Raman spectroscopy (RAMAN), can simultaneously characterize samples in multiple dimensions, expand the analysis range, and obtain richer sample details.

●　Using unique 3D ToF SIMS tomography advanced technology, in-depth characterization of nanoscale materials is achieved through optimized sample geometry.

●　The BrightBeamTM leak free ultra-high resolution electron tube provides ultra-high resolution imaging and nanoscale analysis for various materials, with a low landing energy feature specifically designed for sensitive materials to protect samples from damage.

Product Details

TESCAN AMBER 2, as a new generation FIB-SEM, is designed to enhance the productivity and accuracy of laboratories dedicated to new material development and functional equipment innovation. This system provides a range of advanced automation functions that can meet the stringent requirements of academia and research institutions for work efficiency and accuracy.

The latest generation TESCAN AMBER 2 has completely revolutionized daily workflows with its cutting-edge automation technology. Its precise automatic SEM and FIB alignment functions, designed with ingenuity, greatly accelerate the speed of research projects. The optimized automation program of the system not only greatly improves time efficiency, but also ensures ultimate accuracy and data consistency. Enable researchers to confidently delve into the potential of analysis.

In addition, TESCAN AMBER 2 simplifies the calibration process, greatly enhancing users' ability to operate the instrument, making it easy for even beginners to master. This system supports efficient collaboration among multiple users, not only optimizing device usage efficiency, but also creating a collaborative research environment, providing fertile soil for innovative discovery.

TESCAN AMBER 2 retains highly customized features, giving operators the ability to control instrument parameters, enabling them to finely adjust experimental plans to meet specific research needs.

AMBER 2 provides advanced access permissions for experienced users in its intuitive operating system. This customizable flexibility allows users to finely adjust their workflow to meet the diversity of academic research needs.

The TESCAN AMBER 2 system has completely changed the preparation of TEM samples by providing a fully automated process. This automation covers every step, ensuring the efficiency and reliability of the TEM sample preparation process. Fully utilizing automated workflows has accelerated the preparation of high-quality TEM samples with unprecedented consistency, and provided guidance for users with limited experience in TEM sample preparation, enabling more researchers to apply this technology. By combining the functionality of the standard OrageTM gallium ion focused ion beam tube with TEM sample preparation solutions such as TESCAN OptiLiftTM, TEM AutoPrep, or TESCAN AuraTM integrated Gentle Ion BeamTM, its position as a model of multifunctionality and efficiency in academic research environments has been strengthened.

TESCAN AMBER 2 stands at the forefront of TEM sample preparation technology, providing scientists with unparalleled convenience, precision, and fast comprehensive experience. TESCAN AMBER 2 is the perfect partner for academic personnel dedicated to pushing the boundaries of scientific exploration.

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Basic specifications

BrightBeam ™ Non leakage magnetic ultra-high resolution electron tube

▪ Schottky field emission filament, expected to have a minimum service life of 2 years

▪ Electromagnetic electrostatic composite objective lens

▪ Electron accelerator inside the tube

▪ Multi mode SE and BSE detectors inside the lens barrel

▪ Electron beam landing energy: 50 eV – 30 keV (<50 eV * under electron beam deceleration technology)

▪ Optimizing beam spot by controlling electromagnetic aperture

▪ Probe current: 2 pA-400 nA, continuously adjustable

▪ Field of view: 7 mm @ WD=6 mm,>50 mm @ maximum WD

▪ Magnification factor: 2~2000000 x

Orage ™ Focused ion tube

▪ Liquid metal gallium ion source, expected to have a minimum service life of 3000 μ Ah

▪ Configure piezoelectric driven aperture converter, 30 aperture aperture

▪ Electrostatic beam gate, equipped with Faraday cup

▪ Ion beam energy range: 500 eV -30 keV

▪ Probe current:<1 pA-100 nA

▪ Maximum field of view: 1 mm @ 10 keV

FIB-SEM geometric relationship

▪ SEM working distance at the overlap point: 6 mm

▪ FIB-SEM angle: 55 °

Electron beam resolution

▪ 1.4 nm @ 1 keV (no leakage magnetic field)

▪ 1.3 nm @ 1 keV (deceleration mode)*

▪ 0.9 nm @ 15 keV (no leakage magnetic field)

▪ 0.8 nm @ 30 keV STEM * (no leakage magnetic field)

Low vacuum resolution

▪ 1.8 nm @ 30 keV, GSD detector*

▪ 3.0 nm @ 3 keV, GSD detector*

Lon beam resolution

▪ 2.5 nm @ 30 keV

5-axis computer-controlled optimization center motor-driven sample stage

▪ X&Y axis travel: 130 mm

▪ Z-axis travel: 96 mm

▪ Tilt: computer-controlled center type, -70 ° to+90 °

▪ Rotation: computer-controlled center type, 360 ° (continuously adjustable)

▪ Maximum sample height: 92 mm (can reach 133 mm without installing a rotating table)

▪ Maximum sample size: diameter 180 mm, XY axis movement and rotation are not affected, cannot tilt (placing larger samples may limit movement and rotation)

▪ Maximum sample weight: 8000 g

▪ 1000 g (XYZRT fully movable)

▪ 8000 g (XYZ is fully movable)

▪ Cradle style sample stand*

Note: The range of these movements depends on the actual configuration and the working distance or Z-axis value at that time.
Optional+Recommended Optional * 2 to achieve image navigation for samples no higher than 40mm

Sample room

▪ Width: 340mm

▪ Depth: 315mm

▪ Number of interfaces: 20+

▪ Vibration isolation method: active (built-in)

▪ Expansion: Used for 6 "and 8" wafers*

▪ Expansion: Used for 6 ", 8", and 12 "wafers (requires installation of a cradle style sample stage) * Expansion: Combined Raman Spectrometer (RISETM)*

▪ Infrared camera for observing the internal conditions of the sample room

▪ The second infrared camera*

▪ Integrated plasma cleaner

Vacuum system

▪ High vacuum:<9x10-3 Pa

▪ Low vacuum (N2) */MultiVac (N2, H2O) *: 7-500 Pa

▪ Front stage pump: oil-free dry pump

▪ Sample pre extraction room*

Detector and accessories

▪ Pian meter, including anti-collision alarm function

▪ Everhart Thornley detector (E-T) in the sample room

▪ Multi mode detector (MD) inside the lens barrel

▪ Axial BSE/SE detector inside the tube

▪ Low vacuum secondary electron detector (GSD), used under MultiVac*

▪ Secondary Ion Detector (SITD)*

▪ Scalable scintillation backscattered electron detector (R-BSE)+

▪ Scalable high sensitivity scintillation type backscattered electron detector (LE-BSE)*

▪ Scalable high sensitivity four segment solid-state backscattered electron detector (4Q LE-BSE)*

▪ Scalable scintillation water-cooled backscattered electron detector, heat-resistant temperature<800 ° C*

▪ Scalable scintillation aluminum plated backscattered electron detector, capable of simultaneously receiving cathode fluorescence and backscattered electron signals, (Al-coated BSE *)

▪ Scalable integrated cathode fluorescent detector (CL), 350-650 nm*

▪ Scalable integrated cathode fluorescent detector (CL), 185-850 nm*

▪ Scalable integrated 4-channel color cathode fluorescent detector (Rainbow CL *)

▪ Scalable Scanning Transmission Electron Detector (HADF R-STEM) *, capable of receiving bright field (BF), dark field (DF), and high angle dark field (HADF) signals, can accommodate up to 8 TEM copper grids

▪ Optical navigation and integrated camera (ONCam) * 2

▪ EDS * (third-party) spectrometer

▪ Backscatter electron diffractometer EBSD * (third-party)

▪ Spectrometer WDS * (third-party)

▪ Integrated Time of Flight Secondary Ion Mass Spectrometer TOF-SIMS*

▪ Confocal Raman Spectrometer (RISE) ™)*

Gas injection system

▪ OptiGIS ™* : Single gas injection system (scalable): up to three OptiGIS can be configured ™ Injection system (multiple gas sources to choose from)

Optional gases

▪ Platinum Metal Deposition (Pt)+

▪ Tungsten metal deposition (W)*

▪ Carbon deposition (C)*

▪ Insulator deposition (SiOx)*

▪ Enhanced etching (H2O)*

▪ Enhanced Etching (XeF2)*

▪ Optional other gases*

Attachment

▪ TESCAN OptiLiftTM (XYZR) *

▪ TESCAN Nanomechanical Arm (XYZ)*

▪ Third party provided nano robotic arms*

▪ Charge neutralization gun, used for FIB charge compensation*

▪ Pneumatic piezoelectric shutter with energy spectrum*

▪ TESCAN AuraTM Gentle Ion Beam TM

Electron beam lithography*

▪ Electrostatic beam gate of SEM tube*

▪ TESCAN EssenceTM EBL Kit*

▪ TESCAN FlowTM EBL offline version*

Scanning system

SEM and FIB have their own independent scanning systems:

▪ Residence time: 20 ns -10 ms, step or continuous adjustable

▪ Full image scan, selected area scan, line or point scan

▪ Image rotation, movement, and tilt compensation

▪ Frame accumulation, line accumulation

▪ DrawBeam ™， Digital graphic generator, 16 bit DAC

Electron beam:

▪ Dynamic Focus

▪ Frame Accumulation Drift Correction (DCFA)

Image acquisition

▪ Maximum image pixels: 16k x 16k

▪ Image aspect ratios: 1:1, 4:3, and 2:1

▪ Image stitching, panoramic image size has no upper limit (requires automatic stitching software *)

▪ Capable of supporting up to 8 real-time signal channels simultaneously

▪ Real time pseudo color image and multi-channel signal mixing

▪ Image formats: TIFF, PNG, BMP, JPEG, and GIF

▪ Dynamic range: 8-bit or 16 bit

Electron microscope control accessories and user interface:

▪ Keyboard and Mouse

▪ trackball

▪ Multi functional control panel+

▪ TESCAN Electron Microscope Special Control Software Essence ™

Control electron microscope dedicated computer

▪ High performance configuration: Intel Core i7 or equivalent processor, 32 GB memory, 4 TB HDD hard drive, Nvidia GTX 1660 or equivalent graphics card, Windows 11 Pro 64 bit operating system (detailed information can be provided upon request)

▪ 32 "QHD monitor

TESCAN Essence ™ software

▪ Highly customizable interface layout

▪ Customizable Function Keys (F-keys)

▪ Multi user account management

▪ Quick search bar

▪ Revoke/redo function

▪ Real time display of single, double, four or six images

▪ Multi channel real-time pseudo color image

Automated and Semi Automated Functions

▪ Automatic control of SEM electron gun and FIB ion gun

▪ Alignment of electron gun and electron tube

▪ Contrast brightness

▪ Automatic aggregation, automatic astigmatism correction, automatic objective lens centering

▪ In-Flight Beam Tracing ™ Realize optimization of electron beam and ion beam

▪ Optimization of Electron Beam Spot

▪ Optimization of ion beam spot

▪ Set FIB-SEM image overlap point

▪ GIS nozzle position and temperature control

▪ Automatic FIB setting optimization

Essence ™ Advanced module

▪ Measurement software, tolerance measurement software

▪ image processing

▪ preset parameters

▪ Histogram and LUT adjustment

▪ SharkSEMTM Standard Edition (Remote Control)

▪ 3D anti-collision modeling software

▪ Object area

▪ Optoelectronic combination

▪ DrawBeamTM Electron Beam Writing Software Expert Edition

▪ Scheduled shutdown

▪ FIB-SEM 3D reconstruction*

▪ FIB-SEM 3D Reconstruction Professional Edition */Multimodal Edition*

▪ CORAL ™ (Electron microscopy software module for life sciences)*

▪ automatic slicing ™*

▪ TEM AutoPrep*

▪ TEM AutoPrep Pro*

▪ Automated electron beam writing software (DrawBeam) ™ Automate）*

▪ Automatic puzzle software*

▪ Sample observation*

▪ FIB-SEM Expert PI (Python Script Editor)*

▪ System check*

▪ Synopsys client*

▪ TESCAN Flow ™ (Offline processing software)*

Electron microscope installation

Installation Requirement 1

▪ Power supply: 230V ± 10%/50Hz (or 120V/60Hz - optional), power 2300VA, standard configuration of 2kW UPS

▪ Compressed gas: 5-7 bar (73-102 psi), required to be clean, dry, and oil-free

▪ Compressed nitrogen gas for vacuum release: 1-7 bar (15-102 psi), with a purity of 99.99% or higher (4.0N)

▪ Installation space: minimum space of 4.2 × 3.1 meters; The door width shall not be less than 1.0 meter

Environmental Requirement 1

▪ Environmental temperature: 17-24 ° C, with stable temperature changes within 2 ° C and hourly temperature fluctuations of less than 1 ° C

▪ Relative humidity:<65%

▪ Environmental magnetic field: synchronous<300 nT, asynchronous<100 nT

▪ Vibration:<10 μ m/s (below 30 Hz),<20 μ m/s (above 30 Hz)

▪ Noise: less than 60 dBC

▪ Altitude: not higher than 3000 meters

1. Site measurements must be conducted by technicians authorized by TESCAN. The parameters of the magnetic field are affected by the actual acceleration voltage, and the acceleration voltage measured here is 20 kV

Training

▪ Basic training: TESCAN engineers complete on-site installation of equipment.

▪ Advanced training (optional): TESCAN China demonstration center or user site.

Electron Microscope Layout (Unit: mm)

If the mechanical pump and TESCAN AMBER 2 electron microscope are placed in the same room, it is recommended to purchase a TESCAN static speaker at the same time as the electron microscope. The static speaker is optional and must be ordered separately.

TESCAN AMBER 2 is an upgraded model based on TESCAN S8000G.

TESCAN technology is protected by patents, such as WO2015003671A3, CZ301692B6, US2015279616A1,CZ28392U1, US9721781B2, US10886139B2,

US2019074184A1, WO2019185069A1, WO2021244685A1, CZ2020474A3, etc.

BrightBeam ™, Wide Field Optics ™, In-Flight Beam Tracing ™, DrawBeam ™, TESCAN Essence ™ , TESCAN AuraTM, OptiGISTM, and EquiPower ™ All are

The trademark of TESCAN GROUP, a. s.

Gentle Ion BeamTM is a trademark of Technoorg Linda Co Ltd.

RISE ™ It is a trademark of WITec Wissenschaftliche Instrumente und Technologie GmbH.

Windows ™ It is a trademark of Microsoft Corporation.