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EAGLE-I

●　Maximum detection of surface defects up to 0.2 μ m

●　Multiple amplification to optimize sensitivity

●　Can use detection algorithms based on different regions to optimize sensitivity

●　Can import CAD design drawings, based on drawing detection

●　Able to use different focuses, magnifications, light sources, sensitivities, and detection engines to run continuous scanning within one detection cycle

Product Details

Camtek's Eagle ᵀ - i, designed specifically for speed and accuracy, is one of the fastest and most accurate 2D inspection tools on the market.

This system provides leading 2D inspection capabilities, powered by:

• Genesis detection engine

• New model camera

• New high-end fiber channel model

• Special LED lighting

• Can import CAD design drawings, based on drawing inspection

• Cutting edge processing capability


Eagle ᵀ - i provides advanced solutions for encapsulating applications:

• RDL inspection as low as 2um

• Panel transmission and detection

• Warped wafer transfer and detection


2D detection

Inspection CapabilitiesVarious surface defects inspection of 1 pixel size for Bright Field and 0.5 pixel size for Dark Field
ResolutionMultiple magnifications for optimized sensitivity
Zone EditingCAD based detection
CADEnables running successive scans in one cycle with different focus, magnification, illumination, sensitivity and detection enginea
Multi RecipeEnables running successive scans in one cycle with different focus, magnification, illumination, sensitivity and detection engines
Defect Classification / FilteringFeature based classification
Tool MatchingSimple recipe transfer from system to system
System to System results matching

3D detection

BumptypesCopperpillar,solder,goldbumps,microbumps
CapabilitiesMeasurementofbumpheight,co-planarity,PR/PI thicknessandviaopeningdepthandsurface-to surfacemetrology
CTS‒CamtektriangulationSensor:Highspeed3Dscan
HeightAccuracy①0.1μm
HeightRepeatability①1%ofbumpheightand>0.2μmat3σ
MeasurementRange2‒250μm
CCS-CamtekConfocalSensor:3Dhighresolutionprofileareamapping CCS‒Camtek
HeightRepeatability①0.1μmat3σ
LayerthicknessRange5-200μm
Heightmetrologyrange1μm-300μm
CLIP‒CamtekLightinterferometerprofiler:
Resolution0.05μm
HeightRepeatability①0.2μmat3σ
MeasurementRange0.2-100μm

2D measurement

Object typesBump, RDL, Pad, UBM, Via
CapabilitiesMeasurement of diameter, width, length, placement deviations, overlay, die shift
Accuracy0.1μm
Repeatability0.2μm at 3σ

Program settings

Setup Online and OfflineUser-defined detection parameters per defect type and zone.
Interactive automated routines for easy zone definition定义
Job Portability & Tool MatchingAllows transfer of jobs between compatible models
running on same SW version for system to system results matching

Re evaluation and defect classification

Review OptionsColor
Black & White
IR
Smart GrabCustomized preset for defect type, count and location, minimizing grabbing and verification time, optimizing image quality to defect type
Offline StationPC-based station for viewing and reclassification of defect images captured during scanning (monochrome) or post-scanning (color and/or monochrome)

Output - Camtek Statistical Process Control Software Package

HistogramsDistribution charts of all defect and metrology data
ReportsSPC analysis at lot, wafer and die level, KLARF
Wafer MapsGenerate, import, edit and export wafer maps in over 50 standard and custom formats

System Configuration

Material Handling Dual Arm Auto LoaderDual purpose bare & framed on the same load port
                       Supports Bare, Taiko, Framed, Stretched and Reconstructed wafers
Bare, Taiko, Framed, Stretched and Reconstructed
4”-12” wafer size
Particle Removal SystemRemoves loose particles, eliminating nuisance calls
OCRAutomatic top or bottom wafer ID reading
Barcode ReaderReads data matrix or barcode formats
Factory AutomationSECS/GEM or customized host communication; OHT/AGV ready
CleanlinessSemi class 2 according to ISO-150-14644-1

①‒Accuracy and repeatability on VLSI step target

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