●　Maximum detection of surface defects up to 0.2 μ m

●　Multiple amplification to optimize sensitivity

●　Can use detection algorithms based on different regions to optimize sensitivity

●　Can import CAD design drawings, based on drawing detection

●　Able to use different focuses, magnifications, light sources, sensitivities, and detection engines to run continuous scanning within one detection cycle

●　Detection sensitivity Bright Field-0.42 μ m; Dard Field-0.3μm

●　Multiple amplification to optimize sensitivity

●　Can use detection algorithms based on different regions to optimize sensitivity

●　Can import CAD design drawings, based on drawing detection

●　Able to use different focuses, magnifications, light sources, sensitivities, and detection engines to run continuous scanning within one detection cycle

●　Equipment Matching - Simple Formula Transmission from Device to Device

The Eagle ᵀ - AP platform, designed specifically for the advanced packaging market, integrates 2D and 3D measurement and detection functions while maintaining excellent performance and throughput.

●　Fully supports various types of bump measurements (including solder, gold, copper pillars, and micro bumps)

●　3D measurement capability: bump height, coplanarity, photoresist/polyimide thickness, through-hole depth analysis

●　2D measurement capability: diameter/width/length, positional deviation, etching accuracy, chip offset analysis

●　Bump height, coplanarity, photoresist/polyimide thickness, and through-hole depth measurement, supporting surface to surface measurement

●　Camtek Triangular Measurement Sensor (CTS): High speed 3D Scanning

●　Camtek Confocal Sensor (CCS): 3D High Resolution Regional Topography Mapping

●　Camtek Optical Interference Proformer (CLIP) Technology