The Eagle ᵀ - AP platform, designed specifically for the advanced packaging market, integrates 2D and 3D measurement and detection functions while maintaining excellent performance and throughput.
● Fully supports various types of bump measurements (including solder, gold, copper pillars, and micro bumps)
● 3D measurement capability: bump height, coplanarity, photoresist/polyimide thickness, through-hole depth analysis
● 2D measurement capability: diameter/width/length, positional deviation, etching accuracy, chip offset analysis
The system has leading detection and measurement capabilities, with core advantages derived from:
• Genesis detection engine
• High end optical channel
• Special LED lighting system
• CAD based detection technology
• Cutting edge processing capability
• Support the new generation of bump detection of 2 microns and below
• Single crystal circle can achieve 50 million bump measurements
• Bump key dimensions and surface defect detection
• RDL key dimensions and height measurement
| Inspection Capabilities | Various surface defects inspection of 1 pixel size for Bright Field and 0.5 pixel size for Dark Field |
| Resolution | Multiple magnifications for optimized sensitivity |
| Zone Editing | CAD based detection |
| CAD | Enables running successive scans in one cycle with different focus, magnification, illumination, sensitivity and detection enginea |
| Multi Recipe | Enables running successive scans in one cycle with different focus, magnification, illumination, sensitivity and detection engines |
| Defect Classification / Filtering | Feature based classification |
| Tool Matching | Simple recipe transfer from system to system System to System results matching |
| Bumptypes | Copperpillar,solder,goldbumps,microbumps |
| Capabilities | Measurementofbumpheight,co-planarity,PR/PI thicknessandviaopeningdepthandsurface-tosurfacemetrology |
| CTS‒CamtektriangulationSensor:Highspeed3Dscan | |
| HeightAccuracy① | 0.1μm |
| HeightRepeatability① | 1%ofbumpheightand>0.2μmat3σ |
| MeasurementRange | 2‒250μm |
| CCS-CamtekConfocalSensor:3Dhighresolutionprofileareamapping | |
| HeightRepeatability① | 0.1μmat3σ |
| LayerthicknessRange | 5-200μm |
| Heightmetrologyrange | 1μm-300μm |
| CLIP‒Camtek Lightinterferometerprofiler | |
| Resolution | 0.05μm |
| HeightRepeatability① ⾼度重复精度① | 0.2μmat3σ |
| MeasurementRange 量测范围 | 0.2-100μm |
| Object types | Bump, RDL, Pad, UBM, Via |
| Capabilities | Measurement of diameter, width, length, placement deviations, overlay, die shift |
| Accuracy | 0.1μm |
| Repeatability | 0.2μm at 3σ |
| Setup Online and Offline | User-defined detection parameters per defect type
and zone. Interactive automated routines for easy zone definition |
| Job Portability & Tool Matching | Allows transfer of jobs between compatible models running on same SW version for system to system results matching |
| Review Options | Color Black & White IR |
| Smart Grab | Customized preset for defect type, count and location, minimizing grabbing and verification time, optimizing image quality to defect type |
| Offline Station | PC-based station for viewing and reclassification of defect images captured during scanning (monochrome) or post-scanning (color and/or monochrome) |
| Histograms | Distribution charts of all defect and metrology data |
| Reports | SPC analysis at lot, wafer and die level, KLARF |
| Wafer Maps | Generate, import, edit and export wafer maps in over 50 standard and custom formats |
| Material Handling Dual Arm Auto Loader | Dual purpose bare & framed on the same load port Supports Bare, Taiko, Framed, Stretched and Reconstructed wafers Bare, Taiko, Framed, Stretched and Reconstructed 4”-12” wafer size |
| Particle Removal System | Removes loose particles, eliminating nuisance calls |
| OCR | Automatic top or bottom wafer ID reading |
| Barcode Reader | Reads data matrix or barcode formats |
| Factory Automation | SECS/GEM or customized host communication; OHT/AGV ready |
| Cleanliness | Semi class 2 according to ISO-150-14644-1 |
①‒ AccuracyandrepeatabilityonVLSIsteptarget
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Address：No. 501, Building 01, Northwest District, Suzhou Nano City,
No. 99, Jinjihu Avenue, Suzhou Industrial Park
Hotline：86-0512-62749825
Phone：86-18912625555 Mr Chen
Email：alan.chen@winwintek.com/ wuj@winwintek.com
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