High speed X-ray detection system, small footprint
The Nordson MATRIX XS series for semiconductor back-end setup is an automated inspection platform specifically designed for precise high-speed inspection of semiconductor back-end complex products (such as overlapping bonding lines or dense bonding lines) on Stripe or JEDEC trays.
The Nordson MATRIX system solution embodies a modular detection concept. Up to 4 advanced detection technologies are integrated in one: vertical X-ray detection (2D), oblique X-ray detection (2.5D), 3D SART detection (3D reconstruction), and patented SFT (layered filtering to remove overlap) technology using patented slice filter technology (SFT), off-axis technology (2.5D), and 3D SART (simultaneous algebraic reconstruction technology) transmission X-ray imaging (2D).
The Nordson MATRIX XS series for semiconductor back-end setup is an automated inspection platform specifically designed for precise high-speed inspection of semiconductor back-end complex products (such as overlapping bonding lines or dense bonding lines) on Stripe or JEDEC trays. This setting provides three resolution options:
2.5-3 micron resolution. All gold wires/copper wires with diameters as small as 1.5mil/chip mounting cavity detection
Less than 1 micron resolution. Copper wire/chip mounting cavities with a diameter less than 0.8 mil and cavity detection with bump points as small as 70 microns
The Nordson MATRIX system solution embodies a modular detection concept. Up to 4 advanced detection technologies are integrated in one: vertical X-ray detection (2D), oblique X-ray detection (2.5D), 3D SART detection (3D reconstruction), and patented SFT (layered filtering to remove overlap) technology using patented slice filter technology (SFT), off-axis technology (2.5D), and 3D SART (simultaneous algebraic reconstruction technology) transmission X-ray imaging (2D).
The XS series platform offers the following configurations:
XS-2.5 Vertical Detection (2D)+SFTTM+Tilt Detection (2.5D)
XS-3 Vertical Detection (2D)+SFTTM+Tilt Detection (2.5D)+3D SART
● Online high-speed AXI system
● Micro focal length X-ray tube (closed/maintenance free)
● Up to 5-axis programmable servo motor drive system (X-Y sample disk, Z-axis, X-ray tube, U/V detector)
● Digital CMOS flat panel detector
● Automatic grayscale and geometric verification
● Online board transfer system with automatic width adjustment
● Provide MES interface customization to achieve complete product traceability
● Equipment host equipped with multi-core processors
● Windows 10 platform
MIPS detection platform
● Advanced algorithm library
● Support CAD import to generate inspection lists
● 3D reconstruction technology (3D SART; XS-3 only)
● The Automatic Tree Judgment (ATC) function is used to automatically generate detection strategies
● Offline programming software is used for AXI program generation, debugging, simulation, and providing defect reference images
Verification and process control
● MIPS-Verify provides closed-loop re evaluation function
● MIPS-Proces provides real-time SPC
Unique advanced algorithm library can be used for checking
● Semiconductor applications
● Wire bonding inspection (front/back)
● Thin and complex PCB
● Flexible circuit
● Chip mounting cavity
| Factory requirements | |
| Size | 1760 mm (height) x 1300 mm (width) x 1600 mm (depth) |
| Weight | 2.320 kg |
| Safe operating temperature | 15 ℃ -28 ℃, optimal temperature 20 ℃ -25 ℃ |
| Power consumption | Maximum 6kW |
| Input voltage requirements | 208/400 VAC, 50/60 Hz 3-phase, 24/16 A |
| Compressed air requirements | 5-7 bar,<2 l/min, filtered (30p), dry, oil-free, non condensing |
| X-ray image chain | ||
| X-ray tube (closed tube) | ||
| Power | High resolution settings 100 kV / 20 W | Ultra high resolution setting 160 kV / 20 W |
| Spot size | 4μm | <1μm |
| Object Resolution @ min.Fov | 2,5-3μm | 1-1,5μm |
| Detector type | ||
| CMOS flat panel detector | The pixel size is 50/75 μ m | |
| Grayscale resolution | 14/16 digits | |
| Motor system | |
| Multi axis programmable motion system | |
| Installed shaft | |
| x. Y (linear actuator) | Sample stage |
| Z (servo) | Magnification switching |
| u. V (linear actuator) | Detector motion |
| Track setting | |
| Pattern | Monorail |
| Same side input-output | Dual-track |
| X-ray inspection setup | ||
Tilt detection capability | Tilting angle range: | 0-30 degrees |
FoV range | Vertical 2D FoV: | 5 mm to 25 mm |
Sample testing parameters | ||
Standard settings | Maximum sample size: | 300 mm x 250 mm (depending on the tube and magnification) |
Minimum sample size: | > 60 mm x 25 mm | |
Maximum inspection area (2D): | 300 mm x 250 mm | |
Assemble with reserved gaps | Above the sample (including sample thickness): | +/-25 mm |
Distance below the sample (excluding sample thickness): | +/-25 mm | |
Width required for clamp: | >2,5 mm | |
Sample warpage compensation | Option | Upper clamping or vacuum suction |
| Check speed | |
| Vertical detection speed (XS-2.5, XS-3) | Up to 6 views per second |
| Tilt detection speed (XS-2.5, XS-3) | Up to 5 views per second |
| 3D SART (XS-3) | Up to 1 position per second |
| Optional accessories |
| Bar code reader |
| Substrate transfer configuration: equipped with upper/lower plate/laser marking |
| Top clamp warping compensation |
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Address：No. 501, Building 01, Northwest District, Suzhou Nano City,
No. 99, Jinjihu Avenue, Suzhou Industrial Park
Hotline：86-0512-62749825
Phone：86-18912625555 Mr Chen
Email：alan.chen@winwintek.com/ wuj@winwintek.com
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