High speed X-ray detection system, small footprint

The Nordson MATRIX XS series for semiconductor back-end setup is an automated inspection platform specifically designed for precise high-speed inspection of semiconductor back-end complex products (such as overlapping bonding lines or dense bonding lines) on Stripe or JEDEC trays.

The Nordson MATRIX system solution embodies a modular detection concept. Up to 4 advanced detection technologies are integrated in one: vertical X-ray detection (2D), oblique X-ray detection (2.5D), 3D SART detection (3D reconstruction), and patented SFT (layered filtering to remove overlap) technology using patented slice filter technology (SFT), off-axis technology (2.5D), and 3D SART (simultaneous algebraic reconstruction technology) transmission X-ray imaging (2D).

Nordson MATRIX adopts the X series platform and proposes a specialized high-speed automated X-ray inspection system concept for PCB assembly board inspection of single/multiple panels or samples in trays. All soldering of SMD and PTH components is covered by a dedicated AXI algorithm library.