Nordson MATRIX adopts the X series platform and proposes a specialized high-speed automated X-ray inspection system concept for PCB assembly board inspection of single/multiple panels or samples in trays. All soldering of SMD and PTH components is covered by a dedicated AXI algorithm library.
Nordson MATRIX adopts the X series platform and proposes a specialized high-speed automated X-ray inspection system concept for PCB assembly board inspection of single/multiple panels or samples in trays. All soldering of SMD and PTH components is covered by a dedicated AXI algorithm library.
The Nordson MATRIX system solution proposes a modular detection concept. This platform can adopt up to four advanced technologies in one system: vertical transmission X-ray detection (2D) with patented Slice Filter TechniceTM (SFT) technology, oblique transmission X-ray technology (2.5D), and 3D SART (simultaneous algebraic reconstruction technology).
All soldering of SMD and PTH components is covered by a dedicated AXI algorithm library:
X2 vertical transmission X-ray detection (2D)+SFTTM
X2.5 Vertical Transmission X-ray Detection (2D)+SFTTM+Tilt Transmission X-ray Detection (2.5D)
X3 vertical transmission X-ray detection (2D)+SFTTM+oblique transmission X-ray detection (2.5D)+3D SART
● Industrial computer configuration with multi-core processors
● Windows 10 platform
● MIPS 5 Detection Platform
● Advanced Algorithm Library
● Automatically generate inspection checklist and import it into CAD
● Simultaneous Algebraic Reconstruction Technique (3D SART: limited to X3)
● Automatic Tree Judgment (ATC) technology for generating automatic judgment rules
● AXI program generation and simulation, offline programming station, tuning and defect reference directory
● Verification and process control
● Advanced Algorithm Library
● Automatically generate inspection checklist and import it into CAD
● Simultaneous Algebraic Reconstruction Technique (3D SART: limited to X3)
● Automatic Tree Judgment (ATC) technology for generating automatic judgment rules
● AXI program generation and simulation, offline programming station, tuning and defect reference directory
MIPS检测平台
● Advanced algorithm library
● Support CAD import to generate inspection lists
● 3D reconstruction technology (3D SART; XS-3 only)
● The Automatic Tree Judgment (ATC) function is used to automatically generate detection strategies
● Offline programming software is used for AXI program generation, debugging, simulation, and providing defect reference images
Verification and process control
● MIPs_Verify provides closed-loop re evaluation function
● MIPs_Proces provides real-time SPC
● The high-speed AXI system is used for online detection
● Micro focal spot X-ray tube (closed/maintenance free)
● Multi axis programmable motion system with linear motor drive
● Digital CMOS flat panel detector
● Automatic grayscale and geometric calibration
● The barcode scanner can be used to read serial numbers and switch detection programs, supporting multiple Industry 4.0 standard MES interfaces to achieve traceability of the entire detection process
● Compliant with IPC-CFX standards
For various electronic applications, a unique advanced algorithm library can be utilized, which is particularly suitable for component and solder detection in PCB, hybrid, or chip level assembly processes. The unique advanced algorithm library can be used for electronic applications, especially for components and soldering on printed circuit boards, hybrid circuits, or chip level assembly processes. All standard SMD and THT/PTH components
● BGA and dedicated pillow effect (HIP) algorithm
● Comprehensive QFN&gullwing algorithm
● Powerful welding surface/radiator cavity inspection
● Measurement of filling quality for through-hole welding
● Can detect assembly spacing as small as 1005
| Factory requirements | |
| Size | 1630mm (height) x 1800mm (width) x 1575mm (depth) |
| Adjustable Track Height (SMEMA) | 950mm |
| Weight | 2,800 kg |
| Safe operating temperature | 15 ° -28 ° C, optimal 20 ° -25 ° C |
| Power consumption | Maximum 6 kW |
| Input voltage requirements | 400 VAC, 50/60 Hz 3-phase, 16 A/ 208 VAC, 50/60 Hz 3-phase, 25 A |
| Air requirements | 5-7 Bar, < 2 l/min， Filter (30 μ), dry, oil-free |
| X-ray image chain | |
| X-ray tube (closed tube) | |
| Power | SMT Settings 130 kV/40 W |
| Grayscale resolution | 14 positions |
| Detector type | |
| CMOS flat panel detector | 50 μ m/pixel size (5MPix) 75 μ m/pixel size (3MPix) |
| Motor system | |
| Multi axis programmable motion system | |
| Installed shaft | |
| x. Y (linear actuator) | Sample stage |
| Z (servo) | Magnification switching |
| u. V (linear actuator) | Detector motion |
| Track setting | |
| Online settings | Automatic width adjustment |
| Detection parameters | |
| Maximum sample size | 460 mm x 360 mm |
| Maximum detection area | 460 mm x 360 mm |
| Minimum sample size | 80 mm x 80 mm |
| Sample thickness | 0.8-10mm |
| Maximum sample weight | 5kg |
| Strabismus angle function | Maximum 50 degrees |
| Resolution | As small as 3-4 μ m/pixel |
| Assemble with reserved gaps | |
| Upper limit distance (including sample thickness) | 35 mm |
| Lower limit distance (excluding sample thickness) | 35 mm |
| Minimum edge distance for clamping | 35 mm |
| Check speed | |
| Vertical 2D detection speed: (X2, X2.5, X3) | Up to 6 views per second |
| Tilt 2.5D detection speed (X2.5, X3) | Up to 5 views per second |
| 3D SART (X3) | Maximum 1 second/FiV |
| Option |
| Bar code reader |
| Low dose radiation filter |
| Automatic BCR scanning station (with x-y tracks) |
| Meets Semi standards |
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Address：No. 501, Building 01, Northwest District, Suzhou Nano City,
No. 99, Jinjihu Avenue, Suzhou Industrial Park
Hotline：86-0512-62749825
Phone：86-18912625555 Mr Chen
Email：alan.chen@winwintek.com/ wuj@winwintek.com
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