The scanning electron microscope SU3800/SU3900 launched by Hitachi High Tech combines operability and scalability, and with numerous automation functions, can efficiently unleash its high performance. SU3900 comes standard with a multifunctional oversized sample compartment, which can handle the observation of large samples.

▀　Automatic wheelbase adjustment function

The various adjustment tasks required for adjusting the optical axis and replacing the filament have been automated. This can suppress the deviation between the optical axis and the field of view, so that high-quality data can be obtained with good reproducibility without relying on the skills of the operator.

The SU3800/SU3900 is equipped with automatic adjustment functions for electronic optical systems and detection systems.
       After placing the sample and vacuuming, the image can be automatically adjusted through the automatic start function, and clear images can be obtained immediately after electron beam irradiation.

The highly automated function adopts a newly designed calculation program, which reduces the waiting time to less than one-third of the previous when performing image automatic adjustment functions. No need for tedious portrait adjustments, high-throughput image data can be easily obtained.

The SU3800/SU3900 has expanded its vacuum mode and detection capabilities to meet diverse observation needs. In addition to being able to install secondary electron detectors and high-sensitivity semiconductor backscattered electron detectors that can operate in any vacuum mode, UVD can also be installed. UVD can obtain the concave convex information of the sample and the cathodoluminescence (CL information) generated by electron beam irradiation.

The SU3800/SU3900 are equipped with high-sensitivity low vacuum detectors UVD. In addition to the concave convex image on the surface of the sample, CL information can also be obtained by detecting the cathodoluminescence generated by electron beam irradiation on the sample.

By adopting a design of 4 divisions+1 unit, calculations can be performed for each unit without tilting the sample, resulting in component images, 3D images, and 4-directional concave convex images.

Due to the exquisite design and high sensitivity of the detector, high resolution and high signal-to-noise ratio have been achieved.

SU3800/SU3900 are equipped with sample tables that support oversized/overweight samples

	SU3800	SU3900
Maximum sample size	Diameter 200mm	Diameter 300mm
Maximum observable range	Diameter 130mm	Diameter 200mm
Maximum allowable weight	2kg	5kg(without TZR)
Maximum height that can be carried	80mm	130mm

The operation steps for replacing the sample are displayed on the GUI. It can avoid sample contamination or damage caused by human error. Even uneven or oversized samples that are difficult to detect can be easily replaced.

The optional sample exchange chamber allows for quick replacement of samples while maintaining a vacuum in the main sample chamber, greatly improving work efficiency.

Infrared CCD detector is a device used to monitor the interior of the sample chamber. By using an infrared camera, it is possible to monitor the inside of the sample chamber while observing SEM images. To obtain a more detailed position, the CCD image can be enlarged and the observation position can be moved.

The SU3800/SU3900 can be equipped with a device table movement restriction release function that can improve the freedom of device table movement. According to the operator's judgment, the device table can move freely.
       The device platform movement restriction release function can be used when equipped with a chamber oscilloscope.

The Zigzag function can automatically obtain a continuous field of view. Multi Zigzag can set Zigzag in multiple areas of the sample stage, capture multiple high magnification images in different fields of view, and use the Viewer function to stitch the captured images to create a large field of view image.

SEM MAP combined with GUI realizes wide-angle camera navigation *. By specifying the observation target position on the SEM MAP, it can be smoothly moved to the designated location. Images captured using the large field camera navigation system or external images can be freely zoomed in or out to switch from large field color images to high magnification SEM images.

The camera navigation system can achieve SEM MAP observation with a large field of view through image stitching function. The observation area is Diameter 127mm (SU 3800)/Diameter 200mm (SU3900), and can be linked with the sample stage R to move to the maximum observation area of large samples.

The SEM MAP operation interface can intuitively display the position relationship between the sample and the detector. Therefore, when observing samples with large height differences, the sample stage or electron beam can be rotated according to the needs to obtain the optimal observation and analysis position, avoiding the influence of shadow effects.

The newly developed SEM/EDS integrated function of SU3800/SU3900 can complete a series of operations such as determining test positions, setting conditions, analyzing samples, and generating reports through the SEM operation interface. By controlling SEM, testing efficiency can be improved and the burden on operators can be reduced.

▀　Can be linked to EDS-GUI

For detailed analysis of higher functionality, it can be linked to EDS-GUI for analysis. Simply click on the icon to seamlessly switch with EDS-GUI.

In Report Creator, SEM images, EDS data, CCD camera images, and other collected images can be integrated to generate a report. The created report can be saved in Microsoft Office format. The saved file can be edited through Microsoft Office.

Hitachi map 3D can perform computational analysis on SEM signals from four different directions in the 5-segment backscattered electron detector SU3800/SU3900, generating three-dimensional images. Support measurement of height, volume, and simple surface roughness (surface roughness, line roughness) between 2 points. It can receive signals from four different directions at once, so there is no need to tilt the sample stage or synthesize images.

The SU3800/SU3901 is equipped with IPl and can transfer SEM images to ImagePro, an image processing software developed by Media Cybernetics in the United States. Just click once to transfer data from SEM to image measurement software.

SU3800/SU3900 can be equipped with STEM holder, which can obtain clear STEM images under high-speed scanning

By heating the sample on a heating table, the dynamic changes of the sample can be observed in situ.

Microtest300 (produced by Gatan) can be used to apply pressure to the sample in the sample chamber to observe dynamic changes.

▀　SEM observation case of ion swelling reverse osmosis membrane (RO membrane)

Reverse osmosis membranes (RO membranes) have the property of being permeable to water but impermeable to impurities such as salts. There is a skin layer on the surface of the reverse osmosis membrane, which plays an important role in separating salt and water. There are numerous protrusions on the surface of the skin layer. Through observation, it can be observed that these protrusions expand when wet, but contract in a vacuum environment (a, b).

Dropping an ionic aqueous solution (5%) onto the reverse osmosis membrane that expands due to distilled water, soaking for 4 hours, removing excess ionic liquid solution, and conducting SEM observation, it can be observed that the skin layer maintains an expanded state even under high vacuum (c, d).

Accelerated power plant: 7.0kV
         Signal: SE
         Observation magnification: (a), (c) x5000
         Observation magnification: (b), (d) x20000
       Tilt of the loading platform: 70

▀　Cross section observation of electronic components

This is an example of cross-sectional analysis of electronic components made by ion milling after mechanical polishing. (a) Multiple layers of copper plating can be confirmed through clear crystal orientation. (b) It can be clearly seen that Ag particles are distributed in the alloy layer and Pb free solder particles at the copper plating/solder grain boundary.