INSIDIX hot deformation in France-Win-Win Electronic Technology International Limited

●　Double sided heating on both sides;

●　PID independent regulation of upper and lower temperature, with small temperature difference;

●　Non continuous surface testing;

●　BGA eliminates ball testing;

●　Warpage and CTE can be tested simultaneously;

●　High resolution camera with 12 million pixels;

●　Can test different devices simultaneously.

Full modularity and flexibility

Precise warpage and CTE measurement on a nano micrometer scale across a temperature range of -65°C to 400°C

● Smaller footprint

● Noise level < 50 dB

● Redesigned oven

● New CTE module with improved resolution

● OCT sensor enabling nano-resolution measurement on transparent, semitransparent, and glossy surfaces

● Precise warpage and CTE measurement on a nano micrometer scale across a temperature range of -65°C to 400°C

Full modularity and flexibility

●　Precise warpage and CTE measurement on a micron scale across temperature range of RT to 300°C

●　Scanning and multiscale available

Full modularity and flexibility

●　Precise warpage and CTE measurement on a micron scale across temperature range of RT to 300°C

●　Scanning and multiscale available