MultiPrep ™ The system is suitable for semi-automatic preparation and processing of high-precision (metallographic, SEM, TEM, AFM, etc.) samples. The main performance includes parallel polishing, precise angle polishing, fixed-point polishing, or a combination of several polishing methods. It solves the inconsistency between operators and provides reproducible results; Regardless of their skills, Multiplarp does not need to hold the sample, ensuring that only the sample surface comes into contact with the abrasive.
● The front digital indicator displays real-time material removal rate (sample travel) with a resolution of 1 micron
● The rear digital indicator displays the vertical position (static), with zero function and a resolution of 1 micron
● Dual axis micrometer controls the setting of sample angular coordinates (slope and swing), with+10 °/-2.5 ° amplitude and 0.02 ° increment
● Accurate spindle design ensures that the sample is perpendicular to the grinding disc, allowing it to rotate simultaneously
● 6 times speed sample automatic swing
● 8x speed sample automatic rotation
• Unique fixturing design that allows use of either indexing or T-slot tables
• Soft-starting function for easing blade into cut/material
• Programmable feed rate and cut depth with high speed auto retraction
• Sample rotation for difficult, round or thick samples (requires rotation attachment)
• 7" color LCD touchscreen with keypad entry to control all functions