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Allied Grinding and Cutting Machine

MultiPrep ™ The system is suitable for semi-automatic preparation and processing of high-precision (metallographic, SEM, TEM, AFM, etc.) samples. The main performance includes parallel polishing, precise angle polishing, fixed-point polishing, or a combination of several polishing methods. It solves the inconsistency between operators and provides reproducible results; Regardless of their skills, Multiplarp does not need to hold the sample, ensuring that only the sample surface comes into contact with the abrasive.

 The front digital indicator displays real-time material removal rate (sample travel) with a resolution of 1 micron

 The rear digital indicator displays the vertical position (static), with zero function and a resolution of 1 micron

 Dual axis micrometer controls the setting of sample angular coordinates (slope and swing), with+10 °/-2.5 ° amplitude and 0.02 ° increment

 Accurate spindle design ensures that the sample is perpendicular to the grinding disc, allowing it to rotate simultaneously

 6 times speed sample automatic swing

 8x speed sample automatic rotation

Unique fixturing design that allows use of either indexing or T-slot tables

Soft-starting function for easing blade into cut/material

Programmable feed rate and cut depth with high speed auto retraction

Sample rotation for difficult, round or thick samples (requires rotation attachment)

7" color LCD touchscreen with keypad entry to control all functions