Empower intelligent manufacturing by making thermal failure nowhere to hide!

By combining refrigeration type detectors with lock-in amplification technology, the system can accurately capture weak thermal radiation signals, achieving high-sensitivity and high-resolution failure analysis, thermal diffusion measurement, and non-destructive testing.

Widely used in semiconductor and microelectronics manufacturing, chip level and package level failure analysis: locating chip short circuits, leakage, and functional failure areas; Electronic equipment and PCB detection, PCB board level failure localization: Quickly detect defects such as power short circuits, tin residues, solder pad cracks, etc., supporting wide field scanning; Display screens and consumer electronics: diagnose issues such as screen flicker, ESD static damage, and solder pad voids; Analysis of New Energy and Power Devices, Silicon Carbide (SiC) and GaN Devices: Leakage Path Localization, Thermal Distribution Optimization, Improving Device Reliability; Research on thermoelectric materials and batteries: evaluation of thermoelectric conversion efficiency, warning of battery thermal runaway, optimization of thermal management design; Fields such as scientific research and cutting-edge technology development.