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RIE ion etching ternary system

The reactive ion etching machine (RIE) series products independently developed by Beijing Sanhe Lian Technology Co., Ltd. are based on flat plate capacitive coupled plasma technology. The domestically produced RIE machines are suitable for patterned etching of silicon-based materials such as monocrystalline silicon, polycrystalline silicon, silicon nitride (SiNx), silicon oxide (SiO2), quartz (Quartz), and silicon carbide (SiC), and are high-quality products of domestic RIE machines.

Reactive ion etching (RIE) can be used to prepare micro nano structures and is a type of semiconductor manufacturing process technology. During the RIE etching process, various active particles in the plasma form volatile products with the material surface. These products are carried away from the surface of the material, ultimately achieving anisotropic microstructure etching on the material surface.

The reactive ion etching machine (RIE) series products independently developed by Beijing Sanhe Lian Technology Co., Ltd. are based on flat plate capacitive coupled plasma technology. The domestically produced RIE machines are suitable for patterned etching of silicon-based materials such as monocrystalline silicon, polycrystalline silicon, silicon nitride (SiNx), silicon oxide (SiO2), quartz (Quartz), and silicon carbide (SiC), and are high-quality products of domestic RIE machines.

Reactive ion etching (RIE) can be used to prepare micro nano structures and is a type of semiconductor manufacturing process technology. During the RIE etching process, various active particles in the plasma form volatile products with the material surface. These products are carried away from the surface of the material, ultimately achieving anisotropic microstructure etching on the material surface.